Memory - Modules Products For Sale - PDF - Memory Cards, Modules

Image	Part #	Manufacturer	Description	Quantity	Package / Case	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Memory Types	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Rohs Code	Supply Voltage-Nom (Vsup)	Published	JESD-609 Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Memory Size	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Memory Width	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Endurance	Data Retention Time-Min	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status	Lead Free
	Mfr. Part # XCCACEM64-BG388I Twicea Part # 903-630-XCCACEM64-BG388I	Xilinx Inc.	MODULE FLASH 64MB 388BBGA Datasheet Compare	Min.:1 Mult.:1	388-BBGA	YES	388	-	-	-	-	FLASH	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1999	e0	Obsolete	3 (168 Hours)	388	-	TIN LEAD	85°C	-40°C	8542.32.00.71	BOTTOM	BALL	-	1	1.8V	1.27mm	-	133MHz	-	388	-	-	1.89V	1.83.3V	INDUSTRIAL	1.71V	64MB	-	-	4MX16	-	16	-	67108864 bit	-	SERIAL	-	-	-	1000000 Write/Erase Cycles	-	2.87mm	35mm	35mm	No	Non-RoHS Compliant	Contains Lead
XCCACEM64-BG388I 903-630-XCCACEM64-BG388I Xilinx Inc. RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XCCACEM32-BG388I Twicea Part # 903-630-XCCACEM32-BG388I	Xilinx Inc.	MODULE FLASH 32MB 388BBGA Datasheet Compare	Min.:1 Mult.:1	388-BBGA	YES	388	-	-	-	-	FLASH	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1999	e0	Obsolete	3 (168 Hours)	388	-	TIN LEAD	85°C	-40°C	8542.32.00.71	BOTTOM	BALL	225	1	1.8V	1.27mm	-	133MHz	-	388	-	-	1.89V	1.83.3V	INDUSTRIAL	1.71V	32MB	-	-	2MX16	-	16	-	33554432 bit	-	SERIAL	-	-	-	1000000 Write/Erase Cycles	20	2.87mm	35mm	35mm	No	Non-RoHS Compliant	Contains Lead
XCCACEM32-BG388I 903-630-XCCACEM32-BG388I Xilinx Inc. RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC17256L-DD8I Twicea Part # 903-630-XC17256L-DD8I	AMD Xilinx	Configuration Memory, 256KX1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	55 ns	10 MHz	XILINX INC	-	-	262144 words	1000	85 °C	-40 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	1	-	2.54 mm	unknown	-	-	-	R-XDIP-T8	Not Qualified	-	-	INDUSTRIAL	-	-	SYNCHRONOUS	0.01 mA	1KX8	3-STATE	8	0.00005 A	8192 bit	-	PARALLEL	COMMON	OTP ROM	-	-	-	-	-	-	-	-	-
XC17256L-DD8I 903-630-XC17256L-DD8I AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1718-PD8C Twicea Part # 903-630-XC1718-PD8C	AMD Xilinx	Configuration Memory, 18144X1, CMOS, PDIP8, Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	-	5 MHz	XILINX INC	-	1	18144 words	18144	70 °C	-	PLASTIC/EPOXY	DIP	-	DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	5 V	-	e0	-	-	-	EAR99	TIN LEAD	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	225	-	-	2.54 mm	not_compliant	-	30	-	R-PDIP-T8	Not Qualified	-	-	COMMERCIAL	-	-	-	-	18144X1	3-STATE	1	-	-	-	-	COMMON	CONFIGURATION MEMORY	15 V	-	-	-	-	-	-	-	-
XC1718-PD8C 903-630-XC1718-PD8C AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC17256L-SO8C Twicea Part # 903-630-XC17256L-SO8C	AMD Xilinx	Configuration Memory, 256KX1, CMOS, PDSO8 Datasheet Compare	Min.:1 Mult.:1	-	YES	-	8	65 ns	10 MHz	XILINX INC	-	3	262144 words	8000	70 °C	-	PLASTIC/EPOXY	SOP	-	SOP8,.25	RECTANGULAR	SMALL OUTLINE	Obsolete	No	5 V	-	e0	-	-	-	EAR99	TIN LEAD	-	-	8542.32.00.71	DUAL	GULL WING	225	1	-	1.27 mm	not_compliant	-	30	-	R-PDSO-G8	Not Qualified	-	-	COMMERCIAL	-	-	SYNCHRONOUS	0.01 mA	8KX8	3-STATE	8	0.00005 A	65536 bit	-	PARALLEL	COMMON	OTP ROM	-	-	-	-	-	-	-	-	-
XC17256L-SO8C 903-630-XC17256L-SO8C AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC17128D-DD8R Twicea Part # 903-630-XC17128D-DD8R	AMD Xilinx	Description: Configuration Memory, 128KX1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	-	12.5 MHz	XILINX INC	-	-	131072 words	128000	125 °C	-55 °C	CERAMIC	DIP	-	DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	5 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	-	-	2.54 mm	not_compliant	-	-	-	R-XDIP-T8	Not Qualified	-	-	MILITARY	-	-	-	0.01 mA	128KX1	3-STATE	1	0.00005 A	131072 bit	38535Q/M;38534H;883B	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC17128D-DD8R 903-630-XC17128D-DD8R AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1764-CD8M Twicea Part # 903-630-XC1764-CD8M	AMD Xilinx	Configuration Memory, 64KX1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	-	2.5 MHz	XILINX INC	-	-	65536 words	64000	125 °C	-55 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	-	-	2.54 mm	unknown	-	-	-	R-XDIP-T8	Not Qualified	-	-	MILITARY	-	-	-	0.01 mA	64KX1	3-STATE	1	0.0005 A	65536 bit	-	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC1764-CD8M 903-630-XC1764-CD8M AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1764-PC20I Twicea Part # 903-630-XC1764-PC20I	AMD Xilinx	Configuration Memory, 64KX1, CMOS, PQCC20 Datasheet Compare	Min.:1 Mult.:1	-	YES	-	20	-	2.5 MHz	XILINX INC	-	3	65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	-	LDCC20,.4SQ	SQUARE	CHIP CARRIER	Obsolete	No	5 V	-	e0	-	-	-	EAR99	TIN LEAD	-	-	8542.32.00.71	QUAD	J BEND	225	-	-	1.27 mm	not_compliant	-	30	-	S-PQCC-J20	Not Qualified	-	-	INDUSTRIAL	-	-	-	0.01 mA	64KX1	3-STATE	1	0.0005 A	65536 bit	-	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC1764-PC20I 903-630-XC1764-PC20I AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC17256L-DD8R Twicea Part # 903-630-XC17256L-DD8R	AMD Xilinx	Configuration Memory, 256KX1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	-	10 MHz	XILINX INC	-	-	262144 words	256000	125 °C	-55 °C	CERAMIC	DIP	-	DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	3.3 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	-	-	2.54 mm	not_compliant	-	-	-	R-XDIP-T8	Not Qualified	-	-	MILITARY	-	-	-	0.005 mA	256KX1	3-STATE	1	0.00005 A	262144 bit	38535Q/M;38534H;883B	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC17256L-DD8R 903-630-XC17256L-DD8R AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1765ELPC2OC Twicea Part # 903-630-XC1765ELPC2OC	AMD Xilinx	Configuration Memory, 64KX1, CMOS, PQCC20 Datasheet Compare	Min.:1 Mult.:1	-	YES	-	20	-	2.5 MHz	XILINX INC	-	-	65536 words	64000	70 °C	-	PLASTIC/EPOXY	QCCJ	-	LDCC20,.4SQ	SQUARE	CHIP CARRIER	Transferred	No	3.3 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	QUAD	J BEND	-	-	-	1.27 mm	not_compliant	-	-	-	S-PQCC-J20	Not Qualified	-	-	COMMERCIAL	-	-	-	0.005 mA	64KX1	3-STATE	1	0.00005 A	65536 bit	-	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC1765ELPC2OC 903-630-XC1765ELPC2OC AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1718D-DD8R Twicea Part # 903-630-XC1718D-DD8R	AMD Xilinx	Description: Configuration Memory, 18144X1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	-	5 MHz	XILINX INC	-	-	18144 words	18144	125 °C	-55 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	-	-	2.54 mm	unknown	-	-	-	R-XDIP-T8	Not Qualified	-	-	MILITARY	-	-	-	0.01 mA	18144X1	3-STATE	1	0.0015 A	-	38535Q/M;38534H;883B	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC1718D-DD8R 903-630-XC1718D-DD8R AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1718-PC20C Twicea Part # 903-630-XC1718-PC20C	AMD Xilinx	Description: Configuration Memory, 18144X1, CMOS, PQCC20 Datasheet Compare	Min.:1 Mult.:1	-	YES	-	20	-	5 MHz	XILINX INC	-	3	18144 words	18144	70 °C	-	PLASTIC/EPOXY	QCCJ	-	LDCC20,.4SQ	SQUARE	CHIP CARRIER	Transferred	No	5 V	-	e0	-	-	-	EAR99	TIN LEAD	-	-	8542.32.00.71	QUAD	J BEND	225	-	-	1.27 mm	not_compliant	-	30	-	S-PQCC-J20	Not Qualified	-	-	COMMERCIAL	-	-	-	-	18144X1	3-STATE	1	-	-	-	-	COMMON	CONFIGURATION MEMORY	15 V	-	-	-	-	-	-	-	-
XC1718-PC20C 903-630-XC1718-PC20C AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1764-PC20C Twicea Part # 903-630-XC1764-PC20C	AMD Xilinx	Description: Configuration Memory, 64KX1, CMOS, PQCC20 Datasheet Compare	Min.:1 Mult.:1	-	YES	-	20	-	2.5 MHz	XILINX INC	-	3	65536 words	64000	70 °C	-	PLASTIC/EPOXY	QCCJ	-	LDCC20,.4SQ	SQUARE	CHIP CARRIER	Obsolete	No	5 V	-	e0	-	-	-	EAR99	TIN LEAD	-	-	8542.32.00.71	QUAD	J BEND	225	-	-	1.27 mm	not_compliant	-	30	-	S-PQCC-J20	Not Qualified	-	-	COMMERCIAL	-	-	-	0.01 mA	64KX1	3-STATE	1	0.0005 A	65536 bit	-	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC1764-PC20C 903-630-XC1764-PC20C AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1765EPC2OI Twicea Part # 903-630-XC1765EPC2OI	AMD Xilinx	Configuration Memory, 64KX1, CMOS, PQCC20 Datasheet Compare	Min.:1 Mult.:1	-	YES	-	20	-	10 MHz	XILINX INC	-	-	65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	-	LDCC20,.4SQ	SQUARE	CHIP CARRIER	Transferred	No	5 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	QUAD	J BEND	-	-	-	1.27 mm	not_compliant	-	-	-	S-PQCC-J20	Not Qualified	-	-	INDUSTRIAL	-	-	-	0.01 mA	64KX1	3-STATE	1	0.00005 A	65536 bit	-	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC1765EPC2OI 903-630-XC1765EPC2OI AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1765L-DD8M Twicea Part # 903-630-XC1765L-DD8M	AMD Xilinx	Configuration Memory, 64KX1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	-	2.5 MHz	XILINX INC	-	-	65536 words	64000	125 °C	-55 °C	CERAMIC	DIP	-	DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	3.3 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	-	-	2.54 mm	not_compliant	-	-	-	R-XDIP-T8	Not Qualified	-	-	MILITARY	-	-	-	0.005 mA	64KX1	3-STATE	1	0.0015 A	65536 bit	-	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC1765L-DD8M 903-630-XC1765L-DD8M AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1765L-DD8I Twicea Part # 903-630-XC1765L-DD8I	AMD Xilinx	Description: Configuration Memory, 64KX1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	200 ns	2.5 MHz	XILINX INC	-	-	65536 words	16000	85 °C	-40 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	1	-	2.54 mm	unknown	-	-	-	R-XDIP-T8	Not Qualified	-	-	INDUSTRIAL	-	-	SYNCHRONOUS	0.03 mA	16KX8	3-STATE	8	0.0015 A	131072 bit	-	PARALLEL	COMMON	OTP ROM	-	-	-	-	-	-	-	-	-
XC1765L-DD8I 903-630-XC1765L-DD8I AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC17256D-SO8I Twicea Part # 903-630-XC17256D-SO8I	AMD Xilinx	Description: Configuration Memory, 256KX1, CMOS, PDSO8 Datasheet Compare	Min.:1 Mult.:1	-	YES	-	8	-	12 MHz	XILINX INC	-	3	262144 words	1000	85 °C	-40 °C	PLASTIC/EPOXY	SOP	-	SOP8,.25	RECTANGULAR	SMALL OUTLINE	Obsolete	No	5 V	-	e0	-	-	-	EAR99	TIN LEAD	-	-	8542.32.00.71	DUAL	GULL WING	225	1	-	1.27 mm	not_compliant	-	30	-	R-PDSO-G8	Not Qualified	-	-	INDUSTRIAL	-	-	SYNCHRONOUS	0.01 mA	1KX8	3-STATE	8	0.00005 A	8192 bit	-	PARALLEL	COMMON	OTP ROM	-	-	-	-	-	-	-	-	-
XC17256D-SO8I 903-630-XC17256D-SO8I AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1765L-DD8R Twicea Part # 903-630-XC1765L-DD8R	AMD Xilinx	Description: Configuration Memory, 64KX1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	-	2.5 MHz	XILINX INC	-	-	65536 words	64000	125 °C	-55 °C	CERAMIC	DIP	-	DIP8,.3	RECTANGULAR	IN-LINE	Transferred	No	3.3 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	-	-	2.54 mm	not_compliant	-	-	-	R-XDIP-T8	Not Qualified	-	-	MILITARY	-	-	-	0.005 mA	64KX1	3-STATE	1	0.0015 A	65536 bit	38535Q/M;38534H;883B	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC1765L-DD8R 903-630-XC1765L-DD8R AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC1718L-DD8I Twicea Part # 903-630-XC1718L-DD8I	AMD Xilinx	Configuration Memory, 18144X1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	-	2.5 MHz	XILINX INC	-	-	18144 words	18144	85 °C	-40 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	3.3 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	-	-	2.54 mm	unknown	-	-	-	R-XDIP-T8	Not Qualified	-	-	INDUSTRIAL	-	-	-	0.005 mA	18144X1	3-STATE	1	0.0015 A	-	-	-	COMMON	CONFIGURATION MEMORY	-	-	-	-	-	-	-	-	-
XC1718L-DD8I 903-630-XC1718L-DD8I AMD Xilinx RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # XC17128L-DD8I Twicea Part # 903-630-XC17128L-DD8I	AMD Xilinx	Configuration Memory, 128KX1, CMOS, CDIP8 Datasheet Compare	Min.:1 Mult.:1	-	NO	-	8	45 ns	10 MHz	XILINX INC	-	-	131072 words	2000	85 °C	-40 °C	CERAMIC	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE	Obsolete	No	5 V	-	-	-	-	-	EAR99	-	-	-	8542.32.00.71	DUAL	THROUGH-HOLE	-	1	-	2.54 mm	unknown	-	-	-	R-XDIP-T8	Not Qualified	-	-	INDUSTRIAL	-	-	SYNCHRONOUS	0.01 mA	2KX8	3-STATE	8	0.00005 A	16384 bit	-	PARALLEL	COMMON	OTP ROM	-	-	-	-	-	-	-	-	-
XC17128L-DD8I 903-630-XC17128L-DD8I AMD Xilinx RoHS : Package : - In Stock : - 1 : -

Memory Cards, Modules

Memory - Modules definition: In computing, a memory module is a printed circuit board on which memory integrated circuits are mounted. Memory modules permit easy install... Memory - Modules Product Listing: XCCACEM64-BG388I,XCCACEM32-BG388I,XC17256L-DD8I,XC1718-PD8C,XC17256L-SO8C.Memory Cards, Modules type:Solid State Drives (SSDs), Hard Disk Drives (HDDs)(10166),Memory - Modules(6688),Memory Cards(4950),USB Flash Drives(1677),Specialized(1465) .Memory - Modules has 25 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Twicea.

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Memory Cards, Modules