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XC1718L-DD8I Tech Specifications

Xilinx  XC1718L-DD8I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 8Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Package Description DIP, DIP8,.3
Clock Frequency-Max (fCLK) 2.5 MHz
Number of Words 18144 wordsWord
Number of Words Code 18144Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 3.3 V
ECCN Code EAR99
HTS Code 8542.32.00.71
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-XDIP-T8
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Supply Current-Max 0.005 mA
Organization 18144X1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.0015 A
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
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XC1718L-DD8I Documents

Download datasheets and manufacturer documentation for   XC1718L-DD8I

  • Datasheets
XC1718L-DD8I brand manufacturers: AMD Xilinx, Twicea stock, XC1718L-DD8I reference price.AMD Xilinx. XC1718L-DD8I parameters, XC1718L-DD8I Datasheet PDF and pin diagram description download.You can use the XC1718L-DD8I Memory - Modules, DSP Datesheet PDF, find XC1718L-DD8I pin diagram and circuit diagram and usage method of function,XC1718L-DD8I electronics tutorials.You can download from the Twicea.