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- XCCACEM64-BG388I
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XCCACEM64-BG388I Tech Specifications
Xilinx XCCACEM64-BG388I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Package / Case | 388-BBGA | |
| Surface Mount | YES | |
| Number of Pins | 388Pins | |
| Memory Types | FLASH | |
| Published | 1999 | |
| JESD-609 Code | e0 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 388Terminations | |
| Terminal Finish | TIN LEAD | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| HTS Code | 8542.32.00.71 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Supply Voltage | 1.8V | |
| Terminal Pitch | 1.27mm | |
| Frequency | 133MHz | |
| Pin Count | 388 | |
| Supply Voltage-Max (Vsup) | 1.89V | |
| Power Supplies | 1.83.3V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 1.71V | |
| Memory Size | 64MB | |
| Organization | 4MX16 | |
| Memory Width | 16 | |
| Memory Density | 67108864 bit | |
| Parallel/Serial | SERIAL | |
| Endurance | 1000000 Write/Erase Cycles | |
| Length | 35mm | |
| Height Seated (Max) | 2.87mm | |
| Width | 35mm | |
| Radiation Hardening | No | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
XCCACEM64-BG388I Documents
Download datasheets and manufacturer documentation for XCCACEM64-BG388I
- PCN Obsolescence/ EOLSystemACE MPM 10/Nov/2003
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