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| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Power Rating | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Evaluation Kit | Total RAM Bits | Number of Gates | Contents | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Resistance Tolerance | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Product Length | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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  | Mfr. Part #ATF15XX-DK3Twicea Part #536-339-ATF15XX-DK3 | Microchip Technology |
KIT DEV FOR ATF15XX CPLD'S
Datasheet
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| 1
In Stock
| Min.:1 Mult.:1 | 16 Weeks | - | - | - | - | - | 44 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Box | 1997 | - | - | Discontinued | 1 (Unlimited) | - | - | CPLD | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5V | - | - | Parallel | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Yes | - | - | Board(s), Cable(s) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-RoHS Compliant | Lead Free | |
| ATF15XX-DK3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #M1AFS250-QNG180ITwicea Part #536-339-M1AFS250-QNG180I | Microchip |
FPGA Fusion? Family 250K Gates 1098.9MHz 130nm (CMOS) Technology 1.5V 180-Pin QFN EP
Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | 180 | - | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | - | M1AFS250-QNG180I | - | - | - | - | - | 2 | - | - | - | 85 °C | -40 °C | - | UNSPECIFIED | VBCC | VBCC, LGA180,20X20,20 | LGA180,20X20,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | - | NOT SPECIFIED | 5.31 | - | Yes | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BUTT | NOT SPECIFIED | 0.5 mm | compliant | - | S-XBCC-B180 | 65 | Not Qualified | - | 1.5,3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 65 | 6144 CLBS, 250000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 6144 | 6144 | - | 250000 | - | - | - | 10 mm | 10 mm | - | - | - | ||
| M1AFS250-QNG180I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #A1460A-1PQG160ITwicea Part #536-339-A1460A-1PQG160I | Microchip |
FPGA ACT 3 Family 6K Gates 848 Cells 125MHz 0.8um (CMOS) Technology 5V 160-Pin PQFP
Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | 160 | - | - | 125 MHz | - | - | - | MICROSEMI CORP | - | - | - | A1460A-1PQG160I | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | - | SQUARE | FLATPACK | Obsolete | - | 40 | 5.81 | - | Yes | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | e3 | - | - | - | - | - | - | MATTE TIN | - | - | MAX 131 I/OS | 8542.39.00.01 | - | - | - | QUAD | GULL WING | 245 | 0.65 mm | compliant | - | S-PQFP-G160 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 848 CLBS, 6000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 2.6 ns | 848 | - | - | 6000 | - | - | - | 28 mm | 28 mm | - | - | - | ||
| A1460A-1PQG160I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #A1020B-1PL84MTwicea Part #536-339-A1020B-1PL84M | Microchip |
Axcelerator FPGA 2K System Gates HiRel FPGAs
Datasheet
Compare
| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | 84 | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | A1020B-1PL84M | - | - | - | - | - | 3 | - | - | - | 125 °C | -55 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | - | 30 | 5.8 | - | No | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | e0 | - | - | 3A001.A.2.C | - | - | - | TIN LEAD | - | - | - | 8542.39.00.01 | - | - | - | QUAD | J BEND | 225 | 1.27 mm | compliant | - | S-PQCC-J84 | - | Not Qualified | - | - | MILITARY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 547 | - | - | 2000 | - | - | - | 29.3116 mm | 29.3116 mm | - | - | - | ||
| A1020B-1PL84M | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #A1415A-VQG100ITwicea Part #536-339-A1415A-VQG100I | Microchip |
FPGA ACT 3 Family 1.5K Gates 200 Cells 125MHz 0.8um (CMOS) Technology 5V 100-Pin VQFP
Datasheet
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| Min.:1 Mult.:1 | - | - | Surface Mount | - | - | YES | 100 | - | 100 | - | - | 125 MHz | - | - | - | MICROSEMI CORP | - | - | - | A1415A-VQG100I | - | - | - | - | - | - | - | 80 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | TFQFP | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100 | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | - | - | 5.84 | Compliant | Yes | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | - | - | - | - | QUAD | GULL WING | - | 0.5 mm | compliant | 125 MHz | S-PQFP-G100 | - | - | 5 V | - | INDUSTRIAL | - | 5.5 V | 4.5 V | - | - | - | - | - | 3 ns | - | 3 ns | - | - | - | 200 CLBS, 1500 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 200 | - | - | - | 1500 | - | 200 | - | - | - | - | 264 | 3 ns | 200 | - | - | 1500 | - | - | - | 14 mm | 14 mm | No | - | - | ||
| A1415A-VQG100I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #AT94S10AL-25DGUTwicea Part #536-339-AT94S10AL-25DGU | Microchip |
FPGA - Field Programmable Gate Array ASICS
Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | 256 | - | - | - | - | - | - | MICROCHIP TECHNOLOGY INC | - | - | - | AT94S10AL-25DGU | - | - | - | - | - | - | - | - | - | 80 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | - | 5.3 | - | Yes | - | - | 3.3 V | - | - | - | - | - | - | - | e1 | - | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | - | 3.3 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| AT94S10AL-25DGU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #CORE1553-SATwicea Part #536-339-CORE1553-SA | Microchip |
HARDWARE FOR IP CORE1553
Datasheet
Compare
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Core1553 | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 25.0000 ppm/°C | FPGA | 41.2 kOhm | - | - | - | - | - | - | 0.1 W | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s) | - | - | - | 0.1 | - | - | - | - | - | - | - | - | - | 7.06 | - | - | - | - | - | ||
| CORE1553-SA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #CORE429-SATwicea Part #536-339-CORE429-SA | Microchip |
HW/SW/OTHER
Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | CORE429 | Microchip Technology | - | - | 1 | Core429 | - | - | - | Microchip | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | Bulk | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | - | Actel | - | - | - | - | - | Fusion® | - | - | - | - | - | FPGA | - | - | - | - | - | - | Embedded Solutions | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Development Software | - | - | - | Board(s) | - | - | - | - | - | - | - | - | - | - | - | - | Development Software | - | - | - | - | - | - | ||
| CORE429-SA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2GL150T-1FCG1152ITwicea Part #536-339-M2GL150T-1FCG1152I | Microchip |
FPGA IGLOO2 146124 Cells 400MHz 65nm Technology 1.2V 1152-Pin FBGA
Datasheet
Compare
| 2510
In Stock
| Min.:1 Mult.:1 | - | - | - | Surface Mount | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | 1152 | M2GL150 | - | - | - | - | - | MICROSEMI CORP | - | - | - | M2GL150T-1FCG1152I | - | - | Microchip Technology | - | - | 4 | - | 574 | - | - | - | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | -40 to 100 °C | - | - | IGLOO2 | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | - | - | 5120000 | - | - | - | 1 | - | - | - | - | - | - | 146124 | - | - | - | - | - | 35 mm | 35 mm | - | - | - | |
| M2GL150T-1FCG1152I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2GL010T-1FGG484ITwicea Part #536-339-M2GL010T-1FGG484I | Microchip |
FPGA IGLOO2 12084 Cells 400MHz 65nm Technology 1.2V 484-Pin FBGA
Datasheet
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| 5000
In Stock
| Min.:1 Mult.:1 | - | Production (Last Updated: 2 months ago) | - | Surface Mount | FBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2GL010 | Microchip Technology / Atmel | - | - | 60 | - | MICROSEMI CORP | - | - | - | M2GL010T-1FGG484I | - | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 233 | 12084 LE | - | - | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | - | 0.892167 oz | -40°C ~ 100°C (TJ) | Tray | - | M2GL010T | - | - | - | - | - | - | - | - | 100 °C | -40 °C | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | - | - | - | - | - | 114 kB | - | - | - | - | - | - | 667 Mb/s | - | 233 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | FPGA - Field Programmable Gate Array | - | 933888 | - | - | - | 1 | 4 Transceiver | - | - | - | - | - | 12084 | - | - | - | FPGA - Field Programmable Gate Array | - | 23 mm | 23 mm | - | - | - | |
| M2GL010T-1FGG484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2GL050TS-FGG484ITwicea Part #536-339-M2GL050TS-FGG484I | Microchip |
M2GL050TS-FGG484I 484 Pbga 23X23X2.44MM Tray Rohs Compliant: Yes
Datasheet
Compare
| 2803
In Stock
| Min.:1 Mult.:1 | - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | 484 | M2GL050 | - | - | - | - | - | MICROSEMI CORP | - | - | - | M2GL050TS-FGG484I | - | - | Microchip Technology | - | - | 3 | - | 267 | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | - | IGLOO2 | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | - | 1869824 | - | - | - | - | - | - | - | - | - | - | 56340 | - | - | - | - | - | 23 mm | 23 mm | - | - | - | |
| M2GL050TS-FGG484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2S150T-1FCG1152ITwicea Part #536-339-M2S150T-1FCG1152I | Microchip |
FPGA SmartFusion2 146124 Cells 65nm Technology 1.2V 1152-Pin FP-BGA
Datasheet
Compare
| 2334
In Stock
| Min.:1 Mult.:1 | - | - | - | - | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | 1152 | M2S150 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | - | M2S150T-1FCG1152I | 166 MHz | - | Microchip Technology | - | - | 4 | SMD/SMT | 574 | 146124 LE | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | - | SmartFusion®2 | e1 | - | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | 1 | - | - | FPGA - 150K Logic Modules | - | - | - | 146124 | 1 Core | - | 512KB | - | - | 35 mm | 35 mm | - | - | - | |
| M2S150T-1FCG1152I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2GL010T-1VFG256Twicea Part #536-339-M2GL010T-1VFG256 | Microchip |
M2GL010T-1VFG256 256 Lfbga 14X14X1.56MM Tray Rohs Compliant: Yes
Datasheet
Compare
| 28
In Stock
| Min.:1 Mult.:1 | - | - | - | Surface Mount | 256-LFBGA | YES | - | 256-FPBGA (14x14) | 256 | M2GL010 | - | - | - | - | - | MICROSEMI CORP | - | - | - | M2GL010T-1VFG256 | - | + 85 C | Microchip Technology | 0 C | - | 3 | SMD/SMT | 138 | 12084 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.27 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | - | IGLOO2 | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | S-PBGA-B256 | - | - | 1.2 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | - | - | 933888 | - | - | - | - | 2 Transceiver | - | - | - | - | - | - | - | - | - | - | - | 14 mm | 14 mm | - | - | - | |
| M2GL010T-1VFG256 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2GL050TS-FG896ITwicea Part #536-339-M2GL050TS-FG896I | Microchip |
M2GL050TS-FG896I 896 Pbga 31X31X2.44MM Tray Rohs Compliant: Yes
Datasheet
Compare
| 2730
In Stock
| Min.:1 Mult.:1 | - | - | - | Surface Mount | 896-BGA | YES | - | 896-FBGA (31x31) | 896 | M2GL050 | - | - | - | - | - | MICROSEMI CORP | - | - | - | M2GL050TS-FG896I | - | - | Microchip Technology | - | - | 3 | - | 377 | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | - | No | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | - | IGLOO2 | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | - | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | - | 1869824 | - | - | - | - | - | - | - | - | - | - | 56340 | - | - | - | - | - | 31 mm | 31 mm | - | - | - | |
| M2GL050TS-FG896I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2S060T-1FG676ITwicea Part #536-339-M2S060T-1FG676I | Microchip |
M2S060T-1FG676I 676 Pbga 27X27X2.44MM Tray Rohs Compliant: Yes
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| 2964
In Stock
| Min.:1 Mult.:1 | - | Production (Last Updated: 2 months ago) | - | - | 676-BGA | YES | - | 676-FBGA (27x27) | 676 | M2S060 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | - | M2S060T-1FG676I | 166 MHz | - | Microchip Technology | - | - | 3 | - | 387 | 56520 LE | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | - | SmartFusion®2 | e0 | - | - | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B676 | 387 | Not Qualified | - | 1.2 V | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 387 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | 56520 | 1 Core | - | 256KB | - | - | 27 mm | 27 mm | - | - | - | |
| M2S060T-1FG676I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M1A3P400-FG484ITwicea Part #536-339-M1A3P400-FG484I | Microchip |
IC FPGA 194 I/o 484FBGA
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| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | 484 | - | - | - | - | - | - | MICROSEMI CORP | - | - | - | M1A3P400-FG484I | - | - | - | - | - | 3 | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | 30 | 5.25 | - | No | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e0 | - | - | - | - | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B484 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | 400000 | - | - | - | 23 mm | 23 mm | - | - | - | ||
| M1A3P400-FG484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2GL025-1FCS325Twicea Part #536-339-M2GL025-1FCS325 | Microchip |
M2GL025-1FCS325 325 TFBGA 11X11X1.01MM TRAY ROHS COMPLIANT: YES
Datasheet
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| 45
In Stock
| Min.:1 Mult.:1 | - | - | - | Surface Mount | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | 325 | M2GL025 | - | - | - | - | - | MICROSEMI CORP | - | - | - | M2GL025-1FCS325 | - | + 85 C | Microchip Technology | 0 C | - | - | SMD/SMT | 180 | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | - | No | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | - | IGLOO2 | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | compliant | - | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | 180 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 27696 | - | - | 1130496 | - | - | - | - | - | - | - | - | - | - | 27696 | - | - | - | - | - | - | - | - | - | - | |
| M2GL025-1FCS325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M1A3P600L-FG256Twicea Part #536-339-M1A3P600L-FG256 | Microchip |
FPGA ProASIC?3L Family 600K Gates 781.25MHz 130nm (CMOS) Technology 1.2V 256-Pin FBGA
Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | 256 | - | - | 350 MHz | - | - | - | MICROSEMI CORP | - | - | - | M1A3P600L-FG256 | - | - | - | - | - | 3 | - | - | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | 30 | 5.26 | - | No | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B256 | 177 | Not Qualified | - | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | 13824 | 13824 | - | 600000 | - | - | - | 17 mm | 17 mm | - | - | - | ||
| M1A3P600L-FG256 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2GL010-1VF400ITwicea Part #536-339-M2GL010-1VF400I | Microchip |
FPGA IGLOO2 12084 Cells 65nm Technology 3.3V 400-Pin FP-BGA
Datasheet
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| 45
In Stock
| Min.:1 Mult.:1 | - | Production (Last Updated: 2 months ago) | - | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2GL010 | - | - | - | - | - | MICROSEMI CORP | - | - | - | M2GL010-1VF400I | - | + 100 C | Microchip Technology | - 40 C | - | - | SMD/SMT | 195 | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | - | - | IGLOO2 | - | - | - | - | - | - | - | - | 100 °C | -40 °C | - | 8542.39.00.01 | - | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | - | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | - | - | 1.26 V | 1.14 V | - | 114 kB | - | - | - | - | - | - | - | - | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | - | - | 933888 | - | - | - | 1 | - | - | - | - | - | - | 12084 | - | - | - | - | - | 17 mm | 17 mm | - | - | - | |
| M2GL010-1VF400I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2S010T-VFG400Twicea Part #536-339-M2S010T-VFG400 | Microchip |
FPGA SmartFusion2 Family 12084 Cells 166MHz 65nm Technology 2.5V/3.3V 400-Pin F-BGA
Datasheet
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| 28
In Stock
| Min.:1 Mult.:1 | - | - | - | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | 400 | M2S010 | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | - | M2S010T-VFG400 | 166 MHz | + 85 C | Microchip Technology | 0 C | - | 3 | SMD/SMT | 195 | 12084 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.25 | - | Yes | 1.26 V | 1.14 V | 1.2 V | - | - | - | 0°C ~ 85°C (TJ) | - | - | SmartFusion®2 | e1 | - | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | - | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | STD | - | - | FPGA - 10K Logic Modules | - | - | - | 12084 | 1 Core | - | 256KB | - | - | 17 mm | 17 mm | - | - | - | |
| M2S010T-VFG400 |
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