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A2F500M3G-FG256M Tech Specifications

Microchip  A2F500M3G-FG256M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Package / Case 256-LBGA
Number of Pins 256Pins
Supplier Device Package 256-FPBGA (17x17)
Number of Terminals 256Terminals
Manufacturer Part Number A2F500M3G-FG256M
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Risk Rank 5.84
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Supply Voltage-Max 1.575 V
Supply Voltage-Nom 1.5 V
RoHS Non-Compliant
Number of I/Os MCU - 25, FPGA - 66I/O
Package Tray
Base Product Number A2F500
Mfr Microchip Technology
Product Status Active
Supply Voltage-Min 1.425 V
Operating Temperature -55°C ~ 125°C (TJ)
Series SmartFusion®
Max Operating Temperature 125 °C
Min Operating Temperature -55 °C
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code unknown
Frequency 80 MHz
JESD-30 Code S-PBGA-B256
Number of Outputs 66Outputs
Temperature Grade MILITARY
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART
Architecture MCU, FPGA
Number of Inputs 66Inputs
Organization 11520 CLBS, 500000 GATES
Seated Height-Max 1.7 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of CLBs 11520CLBs
Number of Logic Cells 11520Logic Cells
Number of Equivalent Gates 500000Equivalent Gates
Flash Size 512KB
Length 17 mm
Width 17 mm
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