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A3P600-2FG144I Tech Specifications

Microchip  A3P600-2FG144I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Mounting Type Surface Mount
Package / Case 144-LBGA
Supplier Device Package 144-FPBGA (13x13)
Number of Terminals 144Terminals
Manufacturer Part Number A3P600-2FG144I
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Package Description LBGA,
Risk Rank 5.25
Clock Frequency-Max 350 MHz
Moisture Sensitivity Levels 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Supply Voltage-Max 1.575 V
Supply Voltage-Nom 1.5 V
Reflow Temperature-Max (s) 30
Number of I/Os 97I/Os
Package Tray
Base Product Number A3P600
Mfr Microchip Technology
Product Status Active
Supply Voltage-Min 1.425 V
Operating Temperature -40°C ~ 100°C (TJ)
Series ProASIC3
JESD-609 Code e0
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
HTS Code 8542.39.00.01
Voltage - Supply 1.425V ~ 1.575V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B144
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Organization 13824 CLBS, 600000 GATES
Seated Height-Max 1.55 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 110592
Number of Gates 600000Gates
Speed Grade 2
Number of CLBs 13824CLBs
Number of Equivalent Gates 600000Equivalent Gates
Length 13 mm
Width 13 mm
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