onsemi Expands its Silicon Carbide Fab in the Czech Republic
onsemi has announced the inauguration of its expanded silicon carbide (SiC) fab in Roznov, Czech Republic
Highly integrated PFC boost converters eliminate startup-circuit design challenges
STMicroelectronics has introduced two PFC boost converters with integrated high-voltage startup capability, simplifying design and saving auxiliary circuitry
Chipletz Chooses Xpeedic’s Metis EM Simulation Tool
Metis EM Simulation tool meets unique signal and power integrity analysis challenges
Semiconductor Capillary Underfill for Advanced Silicon Node Flip Chip Applications
Henkel has released its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications.
EPC Opens New Motor Drive Center of Excellence
EPC has opened a new design application center near Turin, Italy, to focus on growing motor drive applications based on GaN technology in the e-mobility, robotics, drones, and industrial automation markets.
Contactless SiC Plasma Epi-prep aims to supersede CMP process
Oxford Instruments announces the introduction of a SiC substrate contactless plasma polishing system providing a replacement for the chemical mechanical planarization (CMP) method.
New insulated CAN measurement module captures up to 1500 V
imc Test & Measurement announces a new highly insulated CAN measurement module which meets the demand of the EV and battery testing markets
emiconductor Capillary Underfill for Advanced Silicon Node Flip Chip Applications
Henkel has released its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications.
Nuclear fusion reaction lasted for 30 seconds at temperature above 100 million °C
An experiment run at Seoul National University in South Korea has simultaneously achieved heat and stability levels close to a viable fusion reactor
Packaged GaN FETs Offers Footprint Compatible Solutions to Optimize Performance vs. Cost
GaN FETs in thermally enhanced QFN packages offer higher performance and smaller solution size for high power density applications including DC-DC conversion, AC/DC chargers, solar optimizers and microinverters, motor drives, and Class D Audio
Flexible SiC-based power modules simplify inverter design
Two new 1.2kV SiC power modules with common configurations provide small size and high power density, simplifying inverter design
Bi-GaN bi-directional GaN HEMTs used inside smartphones
Bi-GaN bi-directional GaN HEMTs save space and facilitate fast charging without suffering from reliability-limiting and potentially dangerous rises in temperature
Introduction to Nexperia Automotive-Grade ICs
Electronics in the automotive industry require accuracy, durability and complete reliability. All systems, including the engine control and modern driver assist, are based on parts that have to endure both high temperature and electrical interference, as well as extended durability of operation.
ASIC vs FPGA Comparison: Performance, Cost, and Design Differences Explained
This article compares Application-Specific Integrated Circuits (ASICs) and Field-Programmable Gate Arrays (FPGAs), two technologies used for creating custom digital circuits.
The Rise of Automotive-Grade SiC/GaN Power Devices in Electric Vehicles
The automotive fast recovery Silicon Carbide (SiC) and Gallium Nitride (GaN) power devices emerge as game-changing technologies.
How to Safely Discharge an AC Capacitor
AC capacitor discharge refers to the process in which a capacitor releases its stored electrical energy in an alternating current (AC) circuit.
Signs of a Bad Camshaft Position Sensor and How to Test it?
A car has a variety of electrical components, one of which is called a camshaft position sensor (CMP). This section will discuss this component, the signs that indicate a problematic camshaft position sensor, and the procedures for doing so.
Symptoms of a Bad Speed Sensor and How to Test It?
Speed sensors are utilized to measure the speed at which devices are spinning. Many vehicles, including automobiles, aerospace vehicles, off-highway and construction equipment, railway vehicles, and military vehicles, require speed sensors.
Current Divider: definition, applications & formula
A current divider is an electrical circuit configuration used to split or divide an input current into multiple branches or paths.
74LS04 Hex Inverter Datasheet(PDF) and Pinout
This article will explain some detailed information about 74LS04 Hex Inverter, including its datasheet, pinout, features and specifications.
C1815 Transistor: Pinout, Features & Specifications
This article gives a comprehensive introduction to the key information of the C1815 transistor
Guide to IC 7408 Logic Gate Chip: Specifications, Applications, and Pinout
The 7408 IC, a crucial component in electronics, features?four logic gates, each with two inputs.