| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. Part #XC1718LSO8ITwicea Part #903-535-XC1718LSO8I | AMD Xilinx |
Configuration Memory, 18144X1, Serial, CMOS, PDSO8, PLASTIC, SOIC-8
Datasheet
Compare
| 758
In Stock
| Min.:1 Mult.:1 | YES | 8 | - | 2.5 MHz | XILINX INC | 3 | 18144 words | 18144 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | PLASTIC, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | GULL WING | 225 | 1 | 1.27 mm | not_compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 0.005 mA | 18144X1 | 3-STATE | 1.75 mm | 1 | 0.0015 A | 18144 bit | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | 4.9 mm | 3.9 mm | |
| XC1718LSO8I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17S15AVOG8ITwicea Part #903-535-XC17S15AVOG8I | AMD Xilinx |
Configuration Memory, 197696X1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8
Datasheet
Compare
| 35
In Stock
| Min.:1 Mult.:1 | YES | 8 | - | - | XILINX INC | 3 | 197696 words | 197696 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 197696X1 | - | 1.2 mm | 1 | - | 197696 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 4.9 mm | 3.9 mm | |
| XC17S15AVOG8I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17256EDD8BTwicea Part #903-535-XC17256EDD8B | AMD Xilinx |
Configuration Memory, 256KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8
Datasheet
Compare
| 730
In Stock
| Min.:1 Mult.:1 | NO | 8 | - | 12.5 MHz | XILINX INC | - | 262144 words | 256000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | CERAMIC, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.61 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | compliant | - | 8 | R-CDIP-T8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | 0.01 mA | 256KX1 | 3-STATE | 5.08 mm | 1 | 0.00005 A | 262144 bit | 38535Q/M;38534H;883B | SERIAL | COMMON | CONFIGURATION MEMORY | - | 10.16 mm | 7.62 mm | |
| XC17256EDD8B | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC1704LVQG44CTwicea Part #903-535-XC1704LVQG44C | AMD Xilinx |
Description: Configuration Memory, 4MX1, Serial, CMOS, PQFP44, PLASTIC, VQFP-44
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 44 | - | - | XILINX INC | 3 | 4194304 words | 4000000 | 70 °C | - | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | Yes | 3.3 V | e3 | - | 3A991.B.1.B.1 | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | QUAD | GULL WING | 260 | 1 | 0.8 mm | compliant | 30 | 44 | S-PQFP-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 4MX1 | - | 1.2 mm | 1 | - | 4194304 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 10 mm | 10 mm | ||
| XC1704LVQG44C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC18V512PC20C0799Twicea Part #903-535-XC18V512PC20C0799 | AMD Xilinx |
Configuration Memory, 64KX8, 15ns, Parallel/serial, CMOS, PQCC20, PLASTIC, LCC-20
Datasheet
Compare
| 588
In Stock
| Min.:1 Mult.:1 | YES | 20 | 15 ns | - | XILINX INC | - | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | - | 3.3 V | - | - | 3A991.B.1.B.2 | - | - | 8542.32.00.51 | QUAD | J BEND | - | 1 | 1.27 mm | unknown | - | 20 | S-PQCC-J20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 64KX8 | - | 4.572 mm | 8 | - | 524288 bit | - | PARALLEL/SERIAL | - | CONFIGURATION MEMORY | - | 8.9662 mm | 8.9662 mm | |
| XC18V512PC20C0799 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17V02PCG20ITwicea Part #903-535-XC17V02PCG20I | AMD Xilinx |
Configuration Memory, 2MX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
Datasheet
Compare
| 735
In Stock
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.1 | Matte Tin (Sn) | - | 8542.32.00.51 | QUAD | J BEND | 245 | 1 | 1.27 mm | compliant | 30 | 20 | S-PQCC-J20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 2MX1 | - | 4.572 mm | 1 | - | 2097152 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 8.9662 mm | 8.9662 mm | |
| XC17V02PCG20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC18V01PC20C0799Twicea Part #903-535-XC18V01PC20C0799 | AMD Xilinx |
Configuration Memory, 128KX8, 15ns, Parallel/serial, CMOS, PQCC20, PLASTIC, LCC-20
Datasheet
Compare
| 67
In Stock
| Min.:1 Mult.:1 | YES | 20 | 15 ns | - | XILINX INC | - | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | - | 3.3 V | - | - | 3A991.B.1.B.2 | - | - | 8542.32.00.51 | QUAD | J BEND | - | 1 | 1.27 mm | unknown | - | 20 | S-PQCC-J20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 128KX8 | - | 4.572 mm | 8 | - | 1048576 bit | - | PARALLEL/SERIAL | - | CONFIGURATION MEMORY | - | 8.9662 mm | 8.9662 mm | |
| XC18V01PC20C0799 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC1765EPCG20ITwicea Part #903-535-XC1765EPCG20I | AMD Xilinx |
Description: Configuration Memory, 64KX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | Yes | 5 V | e3 | - | EAR99 | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | QUAD | J BEND | 260 | 1 | 1.27 mm | compliant | 40 | 20 | S-PQCC-J20 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | - | 64KX1 | - | 4.572 mm | 1 | - | 65536 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 8.9662 mm | 8.9662 mm | ||
| XC1765EPCG20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17256ELPDG8CTwicea Part #903-535-XC17256ELPDG8C | AMD Xilinx |
Description: Configuration Memory, 256KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 8 | - | - | XILINX INC | 1 | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 3.3 V | e3 | - | EAR99 | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | compliant | 40 | 8 | R-PDIP-T8 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 256KX1 | - | 4.5974 mm | 1 | - | 262144 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 9.3599 mm | 7.62 mm | ||
| XC17256ELPDG8C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17256ELPDG8ITwicea Part #903-535-XC17256ELPDG8I | AMD Xilinx |
Configuration Memory, 256KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8
Datasheet
Compare
| 511
In Stock
| Min.:1 Mult.:1 | NO | 8 | - | - | XILINX INC | 1 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 3.3 V | e3 | - | EAR99 | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | compliant | 40 | 8 | R-PDIP-T8 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 256KX1 | - | 4.5974 mm | 1 | - | 262144 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 9.3599 mm | 7.62 mm | |
| XC17256ELPDG8I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17S150ASOG20CTwicea Part #903-535-XC17S150ASOG20C | AMD Xilinx |
Configuration Memory, 1040096X1, Serial, CMOS, PDSO20, PLASTIC, SOIC-20
Datasheet
Compare
| 814
In Stock
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 1040096 words | 1040096 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 1040096X1 | - | 2.65 mm | 1 | - | 1040096 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 12.8 mm | 7.5 mm | |
| XC17S150ASOG20C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC1765LPD8ITwicea Part #903-535-XC1765LPD8I | AMD Xilinx |
Configuration Memory, 64KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8
Datasheet
Compare
| 123
In Stock
| Min.:1 Mult.:1 | NO | 8 | - | 2.5 MHz | XILINX INC | 1 | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | 225 | 1 | 2.54 mm | not_compliant | 30 | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 0.005 mA | 64KX1 | 3-STATE | 4.5974 mm | 1 | 0.0015 A | 65536 bit | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | 9.3599 mm | 7.62 mm | |
| XC1765LPD8I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17128EPCG20ITwicea Part #903-535-XC17128EPCG20I | AMD Xilinx |
Description: Configuration Memory, 128KX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | Yes | 5 V | e3 | - | EAR99 | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | QUAD | J BEND | 260 | 1 | 1.27 mm | compliant | 40 | 20 | S-PQCC-J20 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | - | 128KX1 | - | 4.572 mm | 1 | - | 131072 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 8.9662 mm | 8.9662 mm | ||
| XC17128EPCG20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #5962-9951401QYXTwicea Part #903-535-5962-9951401QYX | AMD Xilinx |
Configuration Memory, 1MX1, Serial, CMOS, CQCC44, CERAMIC, LCC-44
Datasheet
Compare
| 74
In Stock
| Min.:1 Mult.:1 | YES | 44 | 45 ns | 15 MHz | XILINX INC | - | 1048576 words | 1000000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | - | 3.3 V | - | - | 3A001.A.2.C | - | - | 8542.32.00.51 | QUAD | J BEND | - | 1 | - | unknown | - | 44 | S-GQCC-J44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | 0.01 mA | 1MX1 | - | - | 1 | 0.00005 A | 1048576 bit | MIL-PRF-38535 Class Q | SERIAL | - | CONFIGURATION MEMORY | 3.3 V | - | - | |
| 5962-9951401QYX | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17S30AVOG8CTwicea Part #903-535-XC17S30AVOG8C | AMD Xilinx |
Configuration Memory, 336768X1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8
Datasheet
Compare
| 348
In Stock
| Min.:1 Mult.:1 | YES | 8 | - | - | XILINX INC | 3 | 336768 words | 336768 | 70 °C | - | PLASTIC/EPOXY | TSOP2 | TSOP2, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 336768X1 | - | 1.2 mm | 1 | - | 336768 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 4.9 mm | 3.9 mm | |
| XC17S30AVOG8C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17256EVOG8CTwicea Part #903-535-XC17256EVOG8C | AMD Xilinx |
Configuration Memory, 256KX1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8
Datasheet
Compare
| 81
In Stock
| Min.:1 Mult.:1 | YES | 8 | - | - | XILINX INC | 3 | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | TSOP2 | TSOP2, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | Yes | 5 V | e3 | - | EAR99 | MATTE TIN | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | SYNCHRONOUS | - | 256KX1 | - | 1.1938 mm | 1 | - | 262144 bit | - | SERIAL | - | CONFIGURATION MEMORY | - | 4.9276 mm | 3.937 mm | |
| XC17256EVOG8C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #5962-9561701MPXTwicea Part #903-535-5962-9561701MPX | AMD Xilinx |
Configuration Memory, 256KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8
Datasheet
Compare
| 206
In Stock
| Min.:1 Mult.:1 | NO | 8 | - | 12.5 MHz | XILINX INC | - | 262144 words | 256000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | DIP | - | 5 V | - | - | 3A001.A.2.C | - | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | 1 | - | unknown | - | 8 | R-GDIP-T8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | - | 256KX1 | - | - | 1 | - | 262144 bit | MIL-STD-883 | SERIAL | - | CONFIGURATION MEMORY | - | - | - | |
| 5962-9561701MPX | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC18V128VQ44CTwicea Part #903-535-XC18V128VQ44C | AMD Xilinx |
Description: Configuration Memory, 128KX1, 20ns, Parallel/serial, CMOS, PQFP44, PLASTIC, VQFP-44
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 44 | 20 ns | - | XILINX INC | - | 131072 words | 128000 | 70 °C | - | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | - | 3.3 V | - | - | EAR99 | - | - | 8542.32.00.51 | QUAD | GULL WING | - | 1 | 0.8 mm | unknown | - | 44 | S-PQFP-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 128KX1 | - | 1.2 mm | 1 | - | 131072 bit | - | PARALLEL/SERIAL | - | CONFIGURATION MEMORY | - | 10 mm | 10 mm | ||
| XC18V128VQ44C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XQ1704LCCG44BTwicea Part #903-535-XQ1704LCCG44B | AMD Xilinx |
Description: Configuration Memory, 4MX1, CQCC44, CERAMIC, LCC-44
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 44 | - | - | XILINX INC | - | 4194304 words | 4000000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | Yes | 3.3 V | e3 | Yes | 3A001.A.2.C | MATTE TIN | - | 8542.32.00.51 | QUAD | J BEND | - | 1 | 1.27 mm | compliant | - | 44 | S-CQCC-J44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | - | 4MX1 | - | 4.826 mm | 1 | - | 4194304 bit | MIL-PRF-38535 | - | - | CONFIGURATION MEMORY | - | 16.51 mm | 16.51 mm | ||
| XQ1704LCCG44B | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC1718DPC20ITwicea Part #903-535-XC1718DPC20I | AMD Xilinx |
Description: Configuration Memory, 18144X1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 20 | - | 5 MHz | XILINX INC | 3 | 18144 words | 18144 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-20 | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.51 | QUAD | J BEND | 225 | 1 | 1.27 mm | not_compliant | 30 | 20 | S-PQCC-J20 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 0.01 mA | 18144X1 | 3-STATE | 4.572 mm | 1 | 0.0015 A | 18144 bit | - | SERIAL | COMMON | CONFIGURATION MEMORY | - | 8.9662 mm | 8.9662 mm | ||
| XC1718DPC20I |
Index :
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