XC1718DPC20I Tech Specifications

Xilinx  XC1718DPC20I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 20Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code QLCC
Package Description PLASTIC, LCC-20
Clock Frequency-Max (fCLK) 5 MHz
Moisture Sensitivity Levels 3
Number of Words 18144 wordsWord
Number of Words Code 18144Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code QCCJ
Package Equivalence Code LDCC20,.4SQ
Package Shape SQUARE
Package Style CHIP CARRIER
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish TIN LEAD
HTS Code 8542.32.00.51
Terminal Position QUAD
Terminal Form J BEND
Peak Reflow Temperature (Cel) 225
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 20
JESD-30 Code S-PQCC-J20
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 4.5 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.01 mA
Organization 18144X1
Output Characteristics 3-STATE
Seated Height-Max 4.572 mm
Memory Width 1
Standby Current-Max 0.0015 A
Memory Density 18144 bit
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Length 8.9662 mm
Width 8.9662 mm
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XC1718DPC20I Documents

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