Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | Memory IC Type | Data Retention Time-Min | Total Dose | Length | Width | |||||||
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Mfr.XC18V01VQ44C0799Twicea903-535-XC18V01VQ44C0799 | AMD Xilinx |
Configuration Memory, 128KX8, 15ns, Parallel/serial, CMOS, PQFP44, PLASTIC, VQFP-44
| 770
| Min.:1 Mult.:1 | YES | 44 | 15 ns | - | XILINX INC | - | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | - | 3.3 V | - | - | 3A991.B.1.B.2 | - | - | - | 8542.32.00.51 | QUAD | GULL WING | - | 1 | 0.8 mm | unknown | - | 44 | S-PQFP-G44 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 128KX8 | 1.2 mm | 8 | - | 1048576 bit | - | PARALLEL/SERIAL | CONFIGURATION MEMORY | - | - | 10 mm | 10 mm | ||
XC18V01VQ44C0799 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC18128PC20ITwicea903-535-XC18128PC20I | AMD Xilinx |
Configuration Memory, 128KX1, 45ns, Parallel, CMOS, PQCC20, PLASTIC, LCC-20
| 839
| Min.:1 Mult.:1 | YES | 20 | 45 ns | 15 MHz | XILINX INC | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-20 | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 3.3 V | e0 | - | EAR99 | NOR TYPE | TIN LEAD | SERIAL MODE ALSO AVAILABLE | 8542.32.00.51 | QUAD | J BEND | 225 | 1 | 1.27 mm | not_compliant | 30 | 20 | S-PQCC-J20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 0.03 mA | 128KX1 | 4.57 mm | 1 | 0.0001 A | 131072 bit | - | PARALLEL | CONFIGURATION MEMORY | 10 | - | 8.9662 mm | 8.9662 mm | ||
XC18128PC20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC1736EPCG20ITwicea903-535-XC1736EPCG20I | AMD Xilinx |
Configuration Memory, 36288X1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
| 876
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 36288 words | 36288 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | Yes | 5 V | e3 | - | EAR99 | - | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | QUAD | J BEND | 245 | 1 | 1.27 mm | compliant | 30 | 20 | S-PQCC-J20 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | - | 36288X1 | 4.572 mm | 1 | - | 36288 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 8.9662 mm | 8.9662 mm | ||
XC1736EPCG20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC1701SOG20CTwicea903-535-XC1701SOG20C | AMD Xilinx |
Configuration Memory, 1MX1, Serial, CMOS, PDSO20, PLASTIC, SOIC-20
| 689
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 1048576 words | 1000000 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 5 V | e3 | - | EAR99 | - | MATTE TIN | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | SYNCHRONOUS | - | 1MX1 | 2.6416 mm | 1 | - | 1048576 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 12.827 mm | 7.5184 mm | ||
XC1701SOG20C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC18V128PC20CTwicea903-535-XC18V128PC20C | AMD Xilinx |
Configuration Memory, 128KX1, 20ns, Parallel/serial, CMOS, PQCC20, PLASTIC, LCC-20
| 852
| Min.:1 Mult.:1 | YES | 20 | 20 ns | - | XILINX INC | - | 131072 words | 128000 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | - | 3.3 V | - | - | EAR99 | - | - | - | 8542.32.00.51 | QUAD | J BEND | - | 1 | 1.27 mm | unknown | - | 20 | S-PQCC-J20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 128KX1 | 4.572 mm | 1 | - | 131072 bit | - | PARALLEL/SERIAL | CONFIGURATION MEMORY | - | - | 8.9662 mm | 8.9662 mm | ||
XC18V128PC20C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC17V16PCG44CTwicea903-535-XC17V16PCG44C | AMD Xilinx |
Configuration Memory, 2MX8, Parallel/serial, CMOS, PQCC44, PLASTIC, LCC-44
| 395
| Min.:1 Mult.:1 | YES | 44 | - | - | XILINX INC | 3 | 2097152 words | 2000000 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | LCC | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.1 | - | Matte Tin (Sn) | - | 8542.32.00.51 | QUAD | J BEND | 245 | 1 | 1.27 mm | compliant | 30 | 44 | S-PQCC-J44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 2MX8 | 4.57 mm | 8 | - | 16777216 bit | - | PARALLEL/SERIAL | CONFIGURATION MEMORY | - | - | 16.5862 mm | 16.5862 mm | ||
XC17V16PCG44C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XQR17V16VQG44RTwicea903-535-XQR17V16VQG44R | AMD Xilinx |
Configuration Memory, 2MX8, Parallel/serial, CMOS, PQFP44, PLASTIC, VQFP-44
| 454
| Min.:1 Mult.:1 | YES | 44 | - | - | XILINX INC | 3 | 2097152 words | 2000000 | 125 °C | -55 °C | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Transferred | QFP | Yes | 3.3 V | e3 | Yes | 3A001.A.2.C | - | MATTE TIN | - | 8542.32.00.51 | QUAD | GULL WING | 260 | 1 | 0.8 mm | compliant | 30 | 44 | S-PQFP-G44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | - | 2MX8 | 1.2 mm | 8 | - | 16777216 bit | - | PARALLEL/SERIAL | CONFIGURATION MEMORY | - | 50k Rad(Si) V | 10 mm | 10 mm | ||
XQR17V16VQG44R | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC18V01SOG20C0901Twicea903-535-XC18V01SOG20C0901 | AMD Xilinx |
Configuration Memory, 128KX8, 15ns, Parallel/serial, CMOS, PDSO20, SOIC-20
| 939
| Min.:1 Mult.:1 | YES | 20 | 15 ns | - | XILINX INC | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOIC-20 | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.2 | - | MATTE TIN | - | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 1.27 mm | compliant | - | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 128KX8 | 2.65 mm | 8 | - | 1048576 bit | - | PARALLEL/SERIAL | CONFIGURATION MEMORY | - | - | 12.8 mm | 7.5 mm | ||
XC18V01SOG20C0901 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC17S100ASOG20CTwicea903-535-XC17S100ASOG20C | AMD Xilinx |
Configuration Memory, 781216X1, Serial, CMOS, PDSO20, PLASTIC, SOIC-20
| 242
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 781216 words | 781216 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | Yes | EAR99 | - | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 781216X1 | 2.65 mm | 1 | - | 781216 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 12.8 mm | 7.5 mm | ||
XC17S100ASOG20C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XCF01SVOG20C0901Twicea903-535-XCF01SVOG20C0901 | AMD Xilinx |
Description: Configuration Memory, 1MX1, Serial, CMOS, PDSO20, LEAD FREE, PLASTIC, TSSOP-20
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | - | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | - | 3.3 V | - | - | EAR99 | - | - | - | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 0.65 mm | unknown | - | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 1MX1 | 1.19 mm | 1 | - | 1048576 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 6.5024 mm | 4.4 mm | |||
XCF01SVOG20C0901 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC17V08VQG44ITwicea903-535-XC17V08VQG44I | AMD Xilinx |
Description: Configuration Memory, 1MX8, Parallel/serial, CMOS, PQFP44, PLASTIC, QFP-44
| Min.:1 Mult.:1 | YES | 44 | - | - | XILINX INC | 3 | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP, | - | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.1 | - | Matte Tin (Sn) | - | 8542.32.00.51 | QUAD | GULL WING | 260 | 1 | 0.8 mm | compliant | 30 | 44 | S-PQFP-G44 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 1MX8 | 1.2 mm | 8 | - | 8388608 bit | - | PARALLEL/SERIAL | CONFIGURATION MEMORY | - | - | 10 mm | 10 mm | |||
XC17V08VQG44I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC1765ELPCG20ITwicea903-535-XC1765ELPCG20I | AMD Xilinx |
Configuration Memory, 64KX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
| 938
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | Yes | 3.3 V | e3 | - | EAR99 | - | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | QUAD | J BEND | 260 | 1 | 1.27 mm | compliant | 40 | 20 | S-PQCC-J20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 64KX1 | 4.572 mm | 1 | - | 65536 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 8.9662 mm | 8.9662 mm | ||
XC1765ELPCG20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC17128ELPDG8CTwicea903-535-XC17128ELPDG8C | AMD Xilinx |
Description: Configuration Memory, 128KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8
| Min.:1 Mult.:1 | NO | 8 | - | - | XILINX INC | 1 | 131072 words | 128000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 3.3 V | e3 | - | EAR99 | - | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | compliant | 40 | 8 | R-PDIP-T8 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 128KX1 | 4.5974 mm | 1 | - | 131072 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 9.3599 mm | 7.62 mm | |||
XC17128ELPDG8C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC17V04PCG20ITwicea903-535-XC17V04PCG20I | AMD Xilinx |
Description: Configuration Memory, 4MX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.1 | - | Matte Tin (Sn) | - | 8542.32.00.51 | QUAD | J BEND | 245 | 1 | 1.27 mm | compliant | 30 | 20 | S-PQCC-J20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 4MX1 | 4.572 mm | 1 | - | 4194304 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 8.9662 mm | 8.9662 mm | |||
XC17V04PCG20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC17S200XLPDG8ITwicea903-535-XC17S200XLPDG8I | AMD Xilinx |
Configuration Memory, 1335872X1, Serial, CMOS, PDIP8, PLASTIC, DIP-8
| 293
| Min.:1 Mult.:1 | NO | 8 | - | - | XILINX INC | 1 | 1335872 words | 1335872 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.1 | - | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 1335872X1 | 4.5974 mm | 1 | - | 1335872 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 9.3599 mm | 7.62 mm | ||
XC17S200XLPDG8I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC1701SOG20ITwicea903-535-XC1701SOG20I | AMD Xilinx |
Configuration Memory, 1MX1, Serial, CMOS, PDSO20, PLASTIC, SOIC-20
| 674
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 5 V | e3 | - | EAR99 | - | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | - | 1MX1 | 2.6416 mm | 1 | - | 1048576 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 12.827 mm | 7.5184 mm | ||
XC1701SOG20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC17256ELPCG20CTwicea903-535-XC17256ELPCG20C | AMD Xilinx |
Configuration Memory, 256KX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
| 90
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | Yes | 3.3 V | e3 | - | EAR99 | - | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | QUAD | J BEND | 260 | 1 | 1.27 mm | compliant | 40 | 20 | S-PQCC-J20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 256KX1 | 4.572 mm | 1 | - | 262144 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 8.9662 mm | 8.9662 mm | ||
XC17256ELPCG20C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.5962-9951401NXXTwicea903-535-5962-9951401NXX | AMD Xilinx |
Configuration Memory, 1MX1, Serial, CMOS, PDSO20, PLASTIC, MS-013AC, SOP-20
| 272
| Min.:1 Mult.:1 | YES | 20 | - | 15 MHz | XILINX INC | - | 1048576 words | 1000000 | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | - | 3.3 V | - | - | 3A001.A.2.C | - | - | - | 8542.32.00.51 | DUAL | GULL WING | - | 1 | - | unknown | - | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | - | 1MX1 | - | 1 | - | 1048576 bit | MIL-PRF-38535 Class N | SERIAL | CONFIGURATION MEMORY | - | - | - | - | ||
5962-9951401NXX | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC17128ELPCG20CTwicea903-535-XC17128ELPCG20C | AMD Xilinx |
Configuration Memory, 128KX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
| 156
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 131072 words | 128000 | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Obsolete | QLCC | Yes | 3.3 V | e3 | - | EAR99 | - | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | QUAD | J BEND | 260 | 1 | 1.27 mm | compliant | 40 | 20 | S-PQCC-J20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 128KX1 | 4.572 mm | 1 | - | 131072 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 8.9662 mm | 8.9662 mm | ||
XC17128ELPCG20C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr.XC17S15ASOG20ITwicea903-535-XC17S15ASOG20I | AMD Xilinx |
Configuration Memory, 197696X1, Serial, CMOS, PDSO20, PLASTIC, SOIC-20
| 498
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 197696 words | 197696 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | Yes | EAR99 | - | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | - | 197696X1 | 2.65 mm | 1 | - | 197696 bit | - | SERIAL | CONFIGURATION MEMORY | - | - | 12.8 mm | 7.5 mm | ||
XC17S15ASOG20I |
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