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XC17V01VOG8C Tech Specifications

Xilinx  XC17V01VOG8C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code TSOP
Package Description TSOP,
Moisture Sensitivity Levels 3
Number of Words 1048576 wordsWord
Number of Words Code 1000000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code TSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Supply Voltage-Nom (Vsup) 3.3 V
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 3 V
Operating Mode SYNCHRONOUS
Organization 1MX1
Seated Height-Max 1.2 mm
Memory Width 1
Memory Density 1048576 bit
Parallel/Serial SERIAL
Memory IC Type CONFIGURATION MEMORY
Length 4.9 mm
Width 3.9 mm
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XC17V01VOG8C Documents

Download datasheets and manufacturer documentation for   XC17V01VOG8C

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