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Image	Part #	Manufacturer	Description	Availability	Quantity	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Clock Frequency-Max	Data RAM Size	Device Logic Gates	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Operating Supply Current	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Number of Gates	Speed Grade	Primary Attributes	Number of CLBs	Number of Logic Cells	Number of Cores	Number of Equivalent Gates	Flash Size	Length	Width
	Mfr. Part # A2F500M3G-FG484 Twicea Part # 536-492-A2F500M3G-FG484	Microchip Technology	SoC FPGA A2F500M3G-FG484 Datasheet Compare	2428 In Stock	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	A2F500	-	64 kB	500000	-	60	-	-	-	-	80 MHz	1.575 V	+ 85 C	Microchip Technology	1.425 V	0 C	Yes	-	SMD/SMT	204 I/O	-	6000 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	1.5000 V	-	0 to 85 °C	Tray	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2 mA	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	500000	STD	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	1 Core	-	512KB	-	-
A2F500M3G-FG484 536-492-A2F500M3G-FG484 Microchip Technology RoHS : Package : - In Stock : 2428 1 : -
	Mfr. Part # A2F500M3G-FG256 Twicea Part # 536-492-A2F500M3G-FG256	Microchip Technology	SoC FPGA A2F500M3G-FG256 Datasheet Compare	2240 In Stock	Min.:1 Mult.:1	-	FPBGA-256	-	256-FPBGA (17x17)	-	A2F500	-	64 kB	500000	-	90	-	-	-	-	80 MHz	1.575 V	+ 85 C	Microchip Technology	1.425 V	0 C	Yes	-	SMD/SMT	117 I/O	-	6000 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	1.5000 V	-	0 to 85 °C	Tray	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2 mA	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	500000	STD	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	1 Core	-	512KB	-	-
A2F500M3G-FG256 536-492-A2F500M3G-FG256 Microchip Technology RoHS : Package : - In Stock : 2240 1 : -
	Mfr. Part # M2S025TS-1FGG484 Twicea Part # 536-492-M2S025TS-1FGG484	Microchip Technology	SoC FPGA M2S025TS-1FGG484 Datasheet Compare	2740 In Stock	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	M2S025	-	64 kB	-	-	60	MICROSEMI CORP	-	-	M2S025TS-1FGG484	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	267	2308 LAB	27696 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	40	5.8	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	-	27696	1 Core	-	256KB	23 mm	23 mm
M2S025TS-1FGG484 536-492-M2S025TS-1FGG484 Microchip Technology RoHS : Package : - In Stock : 2740 1 : -
	Mfr. Part # A2F200M3F-1CS288 Twicea Part # 536-492-A2F200M3F-1CS288	Microchip Technology	SoC FPGA A2F200M3F-1CS288 Datasheet Compare	39 In Stock	Min.:1 Mult.:1	-	288-TFBGA, CSPBGA	YES	288-CSP (11x11)	288	A2F200	100 MHz	64 kB	-	-	176	MICROSEMI CORP	-	-	A2F200M3F-1CS288	100 MHz	-	-	Microchip Technology	-	-	Yes	-	-	MCU - 31, FPGA - 78	-	2000 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA288,21X21,20	BGA288,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	NOT SPECIFIED	5.24	N	No	-	1.575 V	1.425 V	1.5 V	SmartFusion	-	-	0°C ~ 85°C (TJ)	Tray	A2F200	e0	-	TIN LEAD SILVER	-	8542.39.00.01	CMOS	BOTTOM	BALL	NOT SPECIFIED	0.5 mm	compliant	-	S-PBGA-B288	78	Not Qualified	-	1.5,1.8,2.5,3.3 V	OTHER	-	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	256 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	78	4608 CLBS, 200000 GATES	1.05 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608	1 Core	200000	256KB	11 mm	11 mm
A2F200M3F-1CS288 536-492-A2F200M3F-1CS288 Microchip Technology RoHS : Package : - In Stock : 39 1 : -
	Mfr. Part # A2F500M3G-1CSG288 Twicea Part # 536-492-A2F500M3G-1CSG288	Microchip Technology	SoC FPGA A2F500M3G-1CSG288 Datasheet Compare	2841 In Stock	Min.:1 Mult.:1	-	288-TFBGA, CSPBGA	-	288-CSP (11x11)	-	A2F500	-	64 kB	-	-	176	-	-	-	-	100 MHz	-	-	Microchip Technology	-	-	Yes	-	-	MCU - 31, FPGA - 78	-	6000 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	-	-	0°C ~ 85°C (TJ)	Tray	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	-	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	1 Core	-	512KB	-	-
A2F500M3G-1CSG288 536-492-A2F500M3G-1CSG288 Microchip Technology RoHS : Package : - In Stock : 2841 1 : -
	Mfr. Part # M2S010T-1VFG400I Twicea Part # 536-492-M2S010T-1VFG400I	Microchip Technology	SoC FPGA M2S010T-1VFG400I Datasheet Compare	23 In Stock	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S010	-	64 kB	-	-	90	MICROSEMI CORP	-	-	M2S010T-1VFG400I	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	SMD/SMT	195	1007 LAB	12084 LE	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.27	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	2.5, 3.3 V	-	-40 to 100 °C	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	S-PBGA-B400	195	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	195	-	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	1	FPGA - 10K Logic Modules	-	12084	1 Core	-	256KB	17 mm	17 mm
M2S010T-1VFG400I 536-492-M2S010T-1VFG400I Microchip Technology RoHS : Package : - In Stock : 23 1 : -
	Mfr. Part # M2S090-1FGG484 Twicea Part # 536-492-M2S090-1FGG484	Microchip Technology	SoC FPGA M2S090-1FGG484 Datasheet Compare		Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	M2S090	-	64 kB	-	-	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	267	7193 LAB	86316 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	1	FPGA - 90K Logic Modules	-	-	1 Core	-	512KB	-	-
M2S090-1FGG484 536-492-M2S090-1FGG484 Microchip Technology RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # A2F500M3G-1FG256 Twicea Part # 536-492-A2F500M3G-1FG256	Microchip Technology	SoC FPGA A2F500M3G-1FG256 Datasheet Compare	2940 In Stock	Min.:1 Mult.:1	-	FPBGA-256	YES	256-FPBGA (17x17)	256	A2F500	100 MHz	64 kB	-	-	90	MICROSEMI CORP	-	-	A2F500M3G-1FG256	100 MHz	1.575 V	+ 85 C	Microchip Technology	1.425 V	0 C	Yes	3	SMD/SMT	117 I/O	-	6000 LE	85 °C	Tray	PLASTIC/EPOXY	LBGA	17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256	BGA256,16X16,40	SQUARE	GRID ARRAY, LOW PROFILE	Active	Active	30	5.24	N	No	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	SmartFusion	1.5000 V	-	0 to 85 °C	Tray	A2F500	-	-	TIN LEAD/TIN LEAD SILVER	-	8542.39.00.01	CMOS	BOTTOM	BALL	225	1 mm	compliant	-	S-PBGA-B256	66	Not Qualified	-	1.5,1.8,2.5,3.3 V	OTHER	-	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	66	11520 CLBS, 500000 GATES	1.7 mm	FIELD PROGRAMMABLE GATE ARRAY	500000	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	11520	11520	1 Core	500000	512KB	17 mm	17 mm
A2F500M3G-1FG256 536-492-A2F500M3G-1FG256 Microchip Technology RoHS : Package : - In Stock : 2940 1 : -
	Mfr. Part # M2S060-1FCS325I Twicea Part # 536-492-M2S060-1FCS325I	Microchip Technology	SoC FPGA M2S060-1FCS325I Datasheet Compare	2044 In Stock	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S060	-	64 kB	-	-	176	MICROSEMI CORP	-	-	M2S060-1FCS325I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	200	4710 LAB	56520 LE	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.87	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	-	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 60K Logic Modules	-	56520	1 Core	-	256KB	11 mm	11 mm
M2S060-1FCS325I 536-492-M2S060-1FCS325I Microchip Technology RoHS : Package : - In Stock : 2044 1 : -
	Mfr. Part # A2F500M3G-1PQ208I Twicea Part # 536-492-A2F500M3G-1PQ208I	Microchip Technology	SoC FPGA A2F500M3G-1PQ208I Datasheet Compare		Min.:1 Mult.:1	-	208-BFQFP	-	208-PQFP (28x28)	-	A2F500M3G	-	64 kB	-	-	24	-	-	-	-	100 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	Yes	-	SMD/SMT	113 I/O	-	6000 LE	-	Tray	-	-	-	-	-	-	-	Obsolete	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	-	0.183425 oz	-40°C ~ 100°C (TJ)	Tray	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	500000	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	1 Core	-	512KB	-	-
A2F500M3G-1PQ208I 536-492-A2F500M3G-1PQ208I Microchip Technology RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # M2S050T-1FGG484I Twicea Part # 536-492-M2S050T-1FGG484I	Microchip Technology	SoC FPGA M2S050T-1FGG484I Datasheet Compare	2346 In Stock	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	M2S050	-	64 kB	-	-	60	MICROSEMI CORP	-	-	M2S050T-1FGG484I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	267	4695 LAB	56340 LE	-	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	-	5.76	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	40	S-PBGA-B484	267	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	1	FPGA - 50K Logic Modules	-	56340	1 Core	-	256KB	23 mm	23 mm
M2S050T-1FGG484I 536-492-M2S050T-1FGG484I Microchip Technology RoHS : Package : - In Stock : 2346 1 : -
	Mfr. Part # M2S050T-FGG896 Twicea Part # 536-492-M2S050T-FGG896	Microchip Technology	SoC FPGA M2S050T-FGG896 Datasheet Compare	2859 In Stock	Min.:1 Mult.:1	-	FPBGA-896	YES	896-FBGA (31x31)	896	M2S050	-	64 kB	-	-	27	MICROSEMI CORP	-	-	M2S050T-FGG896	166 MHz	-	+ 85 C	Microchip Technology	-	0 C	Yes	-	SMD/SMT	377 I/O	4695 LAB	56340 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-896	BGA896,30X30,40	SQUARE	GRID ARRAY	Active	Active	40	2.31	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	0 to 85 °C	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B896	377	Not Qualified	1.2 V	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	STD	FPGA - 50K Logic Modules	-	56340	1 Core	-	256KB	31 mm	31 mm
M2S050T-FGG896 536-492-M2S050T-FGG896 Microchip Technology RoHS : Package : - In Stock : 2859 1 : -
	Mfr. Part # M2S005S-1FGG484T2 Twicea Part # 536-492-M2S005S-1FGG484T2	Microchip Technology	SoC FPGA M2S005S-1FGG484T2 Datasheet Compare	5000 In Stock	Min.:1 Mult.:1	-	BGA-484	-	484-FPBGA (23x23)	-	M2S005	-	64 kB	-	191 kbit	60	MICROSEMI CORP	-	-	M2S005S-1FGG484T2	166 MHz	-	+ 85 C	Microchip Technology	-	0 C	Yes	-	SMD/SMT	209 I/O	505 LAB	6060 LE	-	Tray	-	-	,	-	-	-	Active	Active	40	5.81	Details	Yes	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	0 to 85 °C	Tray	SmartFusion2	e1	Yes	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	-	-	250	-	compliant	-	-	-	-	1.2 V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	FIELD PROGRAMMABLE GATE ARRAY	-	1	FPGA - 5K Logic Modules	-	-	1 Core	-	128KB	-	-
M2S005S-1FGG484T2 536-492-M2S005S-1FGG484T2 Microchip Technology RoHS : Package : - In Stock : 5000 1 : -
	Mfr. Part # M2S025T-1FGG484I Twicea Part # 536-492-M2S025T-1FGG484I	Microchip Technology	SoC FPGA M2S025T-1FGG484I Datasheet Compare	2893 In Stock	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	M2S025	-	64 kB	-	-	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	267	2308 LAB	27696 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	1	FPGA - 25K Logic Modules	-	-	1 Core	-	256KB	-	-
M2S025T-1FGG484I 536-492-M2S025T-1FGG484I Microchip Technology RoHS : Package : - In Stock : 2893 1 : -
	Mfr. Part # M2S010-1VFG400 Twicea Part # 536-492-M2S010-1VFG400	Microchip Technology	SoC FPGA M2S010-1VFG400 Datasheet Compare	40 In Stock	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S010	-	64 kB	-	-	90	MICROSEMI CORP	-	-	M2S010-1VFG400	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	195	1007 LAB	12084 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.77	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	S-PBGA-B400	195	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	195	-	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 10K Logic Modules	-	12084	1 Core	-	256KB	17 mm	17 mm
M2S010-1VFG400 536-492-M2S010-1VFG400 Microchip Technology RoHS : Package : - In Stock : 40 1 : -
	Mfr. Part # M2S050-1VFG400I Twicea Part # 536-492-M2S050-1VFG400I	Microchip Technology	SoC FPGA M2S050-1VFG400I Datasheet Compare	2693 In Stock	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S050	-	64 kB	-	-	90	MICROSEMI CORP	-	-	M2S050-1VFG400I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	207	4695 LAB	56340 LE	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.76	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	S-PBGA-B400	207	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	-	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 50K Logic Modules	-	56340	1 Core	-	256KB	17 mm	17 mm
M2S050-1VFG400I 536-492-M2S050-1VFG400I Microchip Technology RoHS : Package : - In Stock : 2693 1 : -
	Mfr. Part # A2F500M3G-CS288 Twicea Part # 536-492-A2F500M3G-CS288	Microchip Technology	SoC FPGA A2F500M3G-CS288 Datasheet Compare	39 In Stock	Min.:1 Mult.:1	-	288-TFBGA, CSPBGA	-	288-CSP (11x11)	-	A2F500	-	64 kB	-	-	176	-	-	-	-	80 MHz	-	-	Microchip Technology	-	-	Yes	-	-	MCU - 31, FPGA - 78	-	6000 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	-	-	0°C ~ 85°C (TJ)	Tray	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	-	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	1 Core	-	512KB	-	-
A2F500M3G-CS288 536-492-A2F500M3G-CS288 Microchip Technology RoHS : Package : - In Stock : 39 1 : -
	Mfr. Part # M2S005S-1VFG400T2 Twicea Part # 536-492-M2S005S-1VFG400T2	Microchip Technology	SoC FPGA M2S005S-1VFG400T2 Datasheet Compare	40 In Stock	Min.:1 Mult.:1	-	BGA-400	-	400-VFBGA (17x17)	-	M2S005	-	64 kB	-	191 kbit	90	-	-	-	-	166 MHz	-	+ 85 C	Microchip Technology	-	0 C	Yes	-	SMD/SMT	171 I/O	505 LAB	6060 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	0.652216 oz	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	1	FPGA - 5K Logic Modules	-	-	1 Core	-	128KB	-	-
M2S005S-1VFG400T2 536-492-M2S005S-1VFG400T2 Microchip Technology RoHS : Package : - In Stock : 40 1 : -
	Mfr. Part # M2S010TS-1VF256I Twicea Part # 536-492-M2S010TS-1VF256I	Microchip Technology	SoC FPGA M2S010TS-1VF256I Datasheet Compare	23 In Stock	Min.:1 Mult.:1	Production (Last Updated: 1 month ago)	VFPBGA-256	YES	256-FPBGA (14x14)	256	M2S010	-	64 kB	-	-	119	MICROSEMI CORP	-	-	M2S010TS-1VF256I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	138	1007 LAB	12084 LE	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-256	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B256	138	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	-	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 10K Logic Modules	-	12084	1 Core	-	256KB	14 mm	14 mm
M2S010TS-1VF256I 536-492-M2S010TS-1VF256I Microchip Technology RoHS : Package : - In Stock : 23 1 : -
	Mfr. Part # M2S060T-1FCSG325 Twicea Part # 536-492-M2S060T-1FCSG325	Microchip Technology	SoC FPGA M2S060T-1FCSG325 Datasheet Compare	2204 In Stock	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S060	-	64 kB	-	-	176	MICROSEMI CORP	-	-	M2S060T-1FCSG325	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	200	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.82	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	-	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 60K Logic Modules	-	56520	1 Core	-	256KB	11 mm	11 mm
M2S060T-1FCSG325 536-492-M2S060T-1FCSG325 Microchip Technology RoHS : Package : - In Stock : 2204 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: A2F500M3G-FG484,A2F500M3G-FG256,M2S025TS-1FGG484,A2F200M3F-1CS288,A2F500M3G-1CSG288.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134263),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Twicea.

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Integrated Circuits (ICs)