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M2S060T-1FCSG325 Tech Specifications
Microchip M2S060T-1FCSG325 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Lifecycle Status | Production (Last Updated: 2 months ago) | |
Package / Case | 325-TFBGA, FCBGA | |
Surface Mount | YES | |
Supplier Device Package | 325-FCBGA (11x11) | |
Number of Terminals | 325Terminals | |
Shipping Restrictions | This product may require additional documentation to export from the United States. | |
RoHS | Details | |
Maximum Clock Frequency | 166 MHz | |
L1 Cache Instruction Memory | - | |
L1 Cache Data Memory | - | |
Data RAM Size | 64 kB | |
Number of Logic Elements | 56520 LELogic Element | |
Moisture Sensitive | Yes | |
Number of Logic Array Blocks - LABs | 4710 LABLogic Array Blocks - LAB | |
Factory Pack QuantityFactory Pack Quantity | 176 | |
Tradename | SmartFusion2 | |
Number of I/Os | 200I/Os | |
Package | Tray | |
Base Product Number | M2S060 | |
Mfr | Microchip Technology | |
Product Status | Active | |
Package Description | FBGA-325 | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Moisture Sensitivity Levels | 3 | |
Package Body Material | PLASTIC/EPOXY | |
Package Equivalence Code | BGA325,21X21,20 | |
Supply Voltage-Nom | 1.2 V | |
Reflow Temperature-Max (s) | 40 | |
Supply Voltage-Min | 1.14 V | |
Operating Temperature-Max | 85 °C | |
Rohs Code | Yes | |
Manufacturer Part Number | M2S060T-1FCSG325 | |
Package Code | TFBGA | |
Package Shape | SQUARE | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROSEMI CORP | |
Supply Voltage-Max | 1.26 V | |
Risk Rank | 5.82 | |
Packaging | Tray | |
Series | SmartFusion2 | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
JESD-609 Code | e1 | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Additional Feature | LG-MIN, WD-MIN | |
HTS Code | 8542.39.00.01 | |
Technology | CMOS | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Peak Reflow Temperature (Cel) | 250 | |
Terminal Pitch | 0.5 mm | |
Reach Compliance Code | compliant | |
JESD-30 Code | S-PBGA-B325 | |
Number of Outputs | 200Outputs | |
Qualification Status | Not Qualified | |
Power Supplies | 1.2 V | |
Temperature Grade | OTHER | |
Speed | 166MHz | |
RAM Size | 64KB | |
Core Processor | ARM® Cortex®-M3 | |
Peripherals | DDR, PCIe, SERDES | |
Program Memory Size | 256 kB | |
Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB | |
Architecture | MCU, FPGA | |
Number of Inputs | 200Inputs | |
Seated Height-Max | 1.01 mm | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Primary Attributes | FPGA - 60K Logic Modules | |
Number of Logic Cells | 56520Logic Cells | |
Number of Cores | 1 CoreCore | |
Flash Size | 256KB | |
Width | 11 mm | |
Length | 11 mm |
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