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| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Seated Height-Max | Bus Compatibility | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. Part #XCZU4EG-3SFVC784ITwicea Part #903-489-XCZU4EG-3SFVC784I | AMD Xilinx |
Description: Microprocessor Circuit
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| 80
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| Min.:1 Mult.:1 | YES | 784 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | - | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | - | 23 mm | 23 mm | |
| XCZU4EG-3SFVC784I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU11EG-3FFVF1517ITwicea Part #903-489-XCZU11EG-3FFVF1517I | AMD Xilinx |
Description: Microprocessor Circuit
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| Min.:1 Mult.:1 | YES | 1517 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1517 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | - | 40 mm | 40 mm | ||
| XCZU11EG-3FFVF1517I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6CG-1SFVC784ETwicea Part #903-489-XCZU6CG-1SFVC784E | AMD Xilinx |
Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 784 | - | XILINX INC | 4 | 100 °C | - | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | - | OTHER | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||
| XCZU6CG-1SFVC784E | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU7EV-3FBVB900ITwicea Part #903-489-XCZU7EV-3FBVB900I | AMD Xilinx |
Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 900 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.97 mm | - | 31 mm | 31 mm | ||
| XCZU7EV-3FBVB900I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU3EG-3SFVA625ETwicea Part #903-489-XCZU3EG-3SFVA625E | AMD Xilinx |
Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 625 | - | XILINX INC | 4 | 100 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | - | - | compliant | - | S-PBGA-B625 | - | OTHER | PROGRAMMABLE SoC | - | - | - | - | ||
| XCZU3EG-3SFVA625E | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-2SBVA484ETwicea Part #903-489-XCZU9CG-2SBVA484E | AMD Xilinx |
Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | - | 100 °C | - | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B484 | - | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU9CG-2SBVA484E | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-2SBVA484ITwicea Part #903-489-XCZU9CG-2SBVA484I | AMD Xilinx |
Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B484 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU9CG-2SBVA484I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6EG-3FFVB1156ITwicea Part #903-489-XCZU6EG-3FFVB1156I | AMD Xilinx |
Description: Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 1156 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1156 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | - | 35 mm | 35 mm | ||
| XCZU6EG-3FFVB1156I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XQ7Z030-2RF900ITwicea Part #903-489-XQ7Z030-2RF900I | AMD Xilinx |
Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 900 | - | XILINX INC | - | - | - | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | No | - | - | - | e0 | TIN LEAD | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | not_compliant | - | S-PBGA-B900 | Not Qualified | - | PROGRAMMABLE SoC | 3.44 mm | - | 31 mm | 31 mm | ||
| XQ7Z030-2RF900I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XQ7Z030-1RF900ITwicea Part #903-489-XQ7Z030-1RF900I | AMD Xilinx |
Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 900 | - | XILINX INC | - | - | - | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | No | - | - | - | e0 | TIN LEAD | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | not_compliant | - | S-PBGA-B900 | Not Qualified | - | PROGRAMMABLE SoC | 3.44 mm | - | 31 mm | 31 mm | ||
| XQ7Z030-1RF900I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-L1SFVA625ITwicea Part #903-489-XCZU9CG-L1SFVA625I | AMD Xilinx |
Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 625 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA625,25X25,32 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.742 V | 0.698 V | 0.72 V | - | - | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B625 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | ||
| XCZU9CG-L1SFVA625I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6CG-2SBVA484ETwicea Part #903-489-XCZU6CG-2SBVA484E | AMD Xilinx |
Description: Microprocessor Circuit
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | - | 100 °C | - | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B484 | - | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU6CG-2SBVA484E | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU4EV-3SFVC784ITwicea Part #903-489-XCZU4EV-3SFVC784I | AMD Xilinx |
Description: Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 784 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, | - | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | - | 23 mm | 23 mm | ||
| XCZU4EV-3SFVC784I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU19EG-3FFVE1924ITwicea Part #903-489-XCZU19EG-3FFVE1924I | AMD Xilinx |
Description: Microprocessor Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 1924 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1924 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | - | 45 mm | 45 mm | ||
| XCZU19EG-3FFVE1924I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-2SFVC784ITwicea Part #903-489-XCZU9CG-2SFVC784I | AMD Xilinx |
Description: Microprocessor Circuit
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | - | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||
| XCZU9CG-2SFVC784I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-1SBVA484ETwicea Part #903-489-XCZU9CG-1SBVA484E | AMD Xilinx |
Description: Microprocessor Circuit
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | - | 100 °C | - | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B484 | - | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU9CG-1SBVA484E | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-1SBVA484ITwicea Part #903-489-XCZU9CG-1SBVA484I | AMD Xilinx |
Microprocessor Circuit
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B484 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU9CG-1SBVA484I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6CG-1SFVA625ETwicea Part #903-489-XCZU6CG-1SFVA625E | AMD Xilinx |
Description: Microprocessor Circuit
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 625 | - | XILINX INC | - | 100 °C | - | PLASTIC/EPOXY | FBGA | FBGA, BGA625,25X25,32 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B625 | - | OTHER | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | ||
| XCZU6CG-1SFVA625E | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6CG-2SFVC784ITwicea Part #903-489-XCZU6CG-2SFVC784I | AMD Xilinx |
Microprocessor Circuit
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | - | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||
| XCZU6CG-2SFVC784I | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU19EG-3FFVC1760ITwicea Part #903-489-XCZU19EG-3FFVC1760I | AMD Xilinx |
Microprocessor Circuit
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1760 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1760 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | - | 42.5 mm | 42.5 mm | ||
| XCZU19EG-3FFVC1760I |
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