Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply

XCZU4EG-3SFVC784I Tech Specifications

Xilinx  XCZU4EG-3SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 784Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description FBGA,
Date Of Intro 2017-02-15
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom 0.9 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B784
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.32 mm
Length 23 mm
Width 23 mm
View Similar

XCZU4EG-3SFVC784I Documents

Download datasheets and manufacturer documentation for   XCZU4EG-3SFVC784I

XCZU4EG-3SFVC784I brand manufacturers: AMD Xilinx, Twicea stock, XCZU4EG-3SFVC784I reference price.AMD Xilinx. XCZU4EG-3SFVC784I parameters, XCZU4EG-3SFVC784I Datasheet PDF and pin diagram description download.You can use the XCZU4EG-3SFVC784I Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU4EG-3SFVC784I pin diagram and circuit diagram and usage method of function,XCZU4EG-3SFVC784I electronics tutorials.You can download from the Twicea.