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Image Part # Manufacturer Description Availability Pricing Quantity Surface MountNumber of TerminalsDate Of IntroIhs ManufacturerMoisture Sensitivity LevelsOperating Temperature-MaxOperating Temperature-MinPackage Body MaterialPackage CodePackage DescriptionPackage Equivalence CodePackage ShapePackage StylePart Life Cycle CodeRohs CodeSupply Voltage-NomJESD-609 CodeTerminal FinishHTS CodeTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Terminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeTemperature GradeuPs/uCs/Peripheral ICs TypeSeated Height-MaxBus CompatibilityLengthWidth
AMD Xilinx XCZU11EG-2LFFVC1156E
Mfr. Part #
XCZU11EG-2LFFVC1156E
Twicea Part #
903-488-XCZU11EG-2LFFVC1156E 		AMD Xilinx
Description: Microprocessor Circuit,
Datasheet Compare
    Min.:1
    Mult.:1
    		 YES 1156 2018-03-09 XILINX INC 4 110 °C - PLASTIC/EPOXY BGA - BGA1156,34X34,40 SQUARE GRID ARRAY Transferred Yes 0.85 V e1 Tin/Silver/Copper (Sn/Ag/Cu) 8542.31.00.01 BOTTOM BALL 245 1 mm compliant 30 S-PBGA-B1156 OTHER PROGRAMMABLE SoC 3.51 mm CAN, I2C, SPI, UART 35 mm 35 mm
    XCZU11EG-2LFFVC1156E
    XCZU11EG-2LFFVC1156E

    903-488-XCZU11EG-2LFFVC1156E AMD Xilinx
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    AMD Xilinx XCZU3CG-2LSBVA484E
    Mfr. Part #
    XCZU3CG-2LSBVA484E
    Twicea Part #
    903-488-XCZU3CG-2LSBVA484E     		AMD Xilinx
    Microprocessor Circuit,
    Datasheet Compare
      Min.:1
      Mult.:1
      		 YES 484 2018-03-09 XILINX INC 4 110 °C - PLASTIC/EPOXY FBGA - BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Transferred Yes 0.85 V e1 Tin/Silver/Copper (Sn/Ag/Cu) 8542.31.00.01 BOTTOM BALL 250 0.8 mm compliant 30 S-PBGA-B484 OTHER PROGRAMMABLE SoC 2.61 mm CAN, I2C, SPI, UART 19 mm 19 mm
      XCZU3CG-2LSBVA484E
      XCZU3CG-2LSBVA484E

      903-488-XCZU3CG-2LSBVA484E AMD Xilinx
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      AMD Xilinx XCZU2EG-2LSFVC784I
      Mfr. Part #
      XCZU2EG-2LSFVC784I
      Twicea Part #
      903-488-XCZU2EG-2LSFVC784I       		AMD Xilinx
      Microcontroller,
      Datasheet Compare
        Min.:1
        Mult.:1
        		 YES 784 - XILINX INC 4 100 °C -40 °C PLASTIC/EPOXY FBGA , BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH Transferred Yes 0.85 V e1 TIN SILVER COPPER 8542.31.00.01 BOTTOM BALL 250 0.8 mm compliant 30 S-PBGA-B784 INDUSTRIAL PROGRAMMABLE SoC 3.32 mm CAN, I2C, SPI, UART 23 mm 23 mm
        XCZU2EG-2LSFVC784I
        XCZU2EG-2LSFVC784I

        903-488-XCZU2EG-2LSFVC784I AMD Xilinx
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        AMD Xilinx XCZU19EG-1LFFVE1924I
        Mfr. Part #
        XCZU19EG-1LFFVE1924I
        Twicea Part #
        903-488-XCZU19EG-1LFFVE1924I         		AMD Xilinx
        Microprocessor Circuit,
        Datasheet Compare
          Min.:1
          Mult.:1
          		 YES 1924 2018-03-09 XILINX INC 4 100 °C -40 °C PLASTIC/EPOXY BGA - BGA1924,44X44,40 SQUARE GRID ARRAY Transferred Yes 0.85 V e1 Tin/Silver/Copper (Sn/Ag/Cu) 8542.31.00.01 BOTTOM BALL 245 1 mm compliant 30 S-PBGA-B1924 INDUSTRIAL PROGRAMMABLE SoC 3.71 mm CAN, I2C, SPI, UART 45 mm 45 mm
          XCZU19EG-1LFFVE1924I
          XCZU19EG-1LFFVE1924I

          903-488-XCZU19EG-1LFFVE1924I AMD Xilinx
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          AMD Xilinx XCZU4CG-2LFBVB900E
          Mfr. Part #
          XCZU4CG-2LFBVB900E
          Twicea Part #
          903-488-XCZU4CG-2LFBVB900E           		AMD Xilinx
          Microprocessor Circuit,
          Datasheet Compare
            Min.:1
            Mult.:1
            		 YES 900 2018-03-09 XILINX INC 4 110 °C - PLASTIC/EPOXY BGA - BGA900,30X30,40 SQUARE GRID ARRAY Transferred Yes 0.85 V e1 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) 8542.31.00.01 BOTTOM BALL - 1 mm compliant - S-PBGA-B900 OTHER PROGRAMMABLE SoC 2.88 mm CAN, I2C, SPI, UART 31 mm 31 mm
            XCZU4CG-2LFBVB900E
            XCZU4CG-2LFBVB900E

            903-488-XCZU4CG-2LFBVB900E AMD Xilinx
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            AMD Xilinx XCZU7CG-2LFFVC1156E
            Mfr. Part #
            XCZU7CG-2LFFVC1156E
            Twicea Part #
            903-488-XCZU7CG-2LFFVC1156E             		AMD Xilinx
            Microprocessor Circuit,
            Datasheet Compare
              Min.:1
              Mult.:1
              		 YES 1156 2018-03-09 XILINX INC 4 110 °C - PLASTIC/EPOXY BGA - BGA1156,34X34,40 SQUARE GRID ARRAY Transferred Yes 0.85 V e1 Tin/Silver/Copper (Sn/Ag/Cu) 8542.31.00.01 BOTTOM BALL 245 1 mm compliant 30 S-PBGA-B1156 OTHER PROGRAMMABLE SoC 3.51 mm CAN, I2C, SPI, UART 35 mm 35 mm
              XCZU7CG-2LFFVC1156E
              XCZU7CG-2LFFVC1156E

              903-488-XCZU7CG-2LFFVC1156E AMD Xilinx
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              AMD Xilinx XCZU6CG-2LFFVB1156I
              Mfr. Part #
              XCZU6CG-2LFFVB1156I
              Twicea Part #
              903-488-XCZU6CG-2LFFVB1156I               		AMD Xilinx
              Microcontroller,
              Datasheet Compare
                Min.:1
                Mult.:1
                		 YES 1156 - XILINX INC - 100 °C -40 °C PLASTIC/EPOXY BGA , BGA1156,34X34,40 SQUARE GRID ARRAY Transferred Yes 0.85 V - - 8542.31.00.01 BOTTOM BALL - 1 mm compliant - S-PBGA-B1156 INDUSTRIAL PROGRAMMABLE SoC 3.42 mm CAN, I2C, SPI, UART 35 mm 35 mm
                XCZU6CG-2LFFVB1156I
                XCZU6CG-2LFFVB1156I

                903-488-XCZU6CG-2LFFVB1156I AMD Xilinx
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                AMD Xilinx XCZU5CG-2LSFVC784I
                Mfr. Part #
                XCZU5CG-2LSFVC784I
                Twicea Part #
                903-488-XCZU5CG-2LSFVC784I                 		AMD Xilinx
                Description: Microcontroller,
                Datasheet Compare
                  Min.:1
                  Mult.:1
                  		 YES 784 - XILINX INC 4 100 °C -40 °C PLASTIC/EPOXY FBGA , BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH Transferred Yes 0.85 V e1 TIN SILVER COPPER 8542.31.00.01 BOTTOM BALL 250 0.8 mm compliant 30 S-PBGA-B784 INDUSTRIAL PROGRAMMABLE SoC 3.32 mm CAN, I2C, SPI, UART 23 mm 23 mm
                  XCZU5CG-2LSFVC784I
                  XCZU5CG-2LSFVC784I

                  903-488-XCZU5CG-2LSFVC784I AMD Xilinx
                  RoHS :
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                  In Stock : -
                  1 : -
                  AMD Xilinx XCZU3EG-2LSFVC784I
                  Mfr. Part #
                  XCZU3EG-2LSFVC784I
                  Twicea Part #
                  903-488-XCZU3EG-2LSFVC784I                   		AMD Xilinx
                  Description: Microcontroller,
                  Datasheet Compare
                    Min.:1
                    Mult.:1
                    		 YES 784 - XILINX INC 4 100 °C -40 °C PLASTIC/EPOXY FBGA , BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH Transferred Yes 0.85 V e1 TIN SILVER COPPER 8542.31.00.01 BOTTOM BALL 250 0.8 mm compliant 30 S-PBGA-B784 INDUSTRIAL PROGRAMMABLE SoC 3.32 mm CAN, I2C, SPI, UART 23 mm 23 mm
                    XCZU3EG-2LSFVC784I
                    XCZU3EG-2LSFVC784I

                    903-488-XCZU3EG-2LSFVC784I AMD Xilinx
                    RoHS :
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                    1 : -
                    AMD Xilinx XCZU2EG-1LSBVA484I
                    Mfr. Part #
                    XCZU2EG-1LSBVA484I
                    Twicea Part #
                    903-488-XCZU2EG-1LSBVA484I                     		AMD Xilinx
                    Description: Microprocessor Circuit,
                    Datasheet Compare
                      Min.:1
                      Mult.:1
                      		 YES 484 2018-03-09 XILINX INC 4 100 °C -40 °C PLASTIC/EPOXY FBGA - BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Transferred Yes 0.85 V e1 Tin/Silver/Copper (Sn/Ag/Cu) 8542.31.00.01 BOTTOM BALL 250 0.8 mm compliant 30 S-PBGA-B484 INDUSTRIAL PROGRAMMABLE SoC 2.61 mm CAN, I2C, SPI, UART 19 mm 19 mm
                      XCZU2EG-1LSBVA484I
                      XCZU2EG-1LSBVA484I

                      903-488-XCZU2EG-1LSBVA484I AMD Xilinx
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                      In Stock : -
                      1 : -
                      AMD Xilinx XCZU6EG-2LFFVB1156E
                      Mfr. Part #
                      XCZU6EG-2LFFVB1156E
                      Twicea Part #
                      903-488-XCZU6EG-2LFFVB1156E                       		AMD Xilinx
                      Description: Microprocessor Circuit,
                      Datasheet Compare
                        Min.:1
                        Mult.:1
                        		 YES 1156 2018-03-09 XILINX INC 4 110 °C - PLASTIC/EPOXY BGA - BGA1156,34X34,40 SQUARE GRID ARRAY Transferred Yes 0.85 V e1 Tin/Silver/Copper (Sn/Ag/Cu) 8542.31.00.01 BOTTOM BALL 245 1 mm compliant 30 S-PBGA-B1156 OTHER PROGRAMMABLE SoC 3.42 mm CAN, I2C, SPI, UART 35 mm 35 mm
                        XCZU6EG-2LFFVB1156E
                        XCZU6EG-2LFFVB1156E

                        903-488-XCZU6EG-2LFFVB1156E AMD Xilinx
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                        In Stock : -
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                        AMD Xilinx XCZU9CG-2LFFVC900E
                        Mfr. Part #
                        XCZU9CG-2LFFVC900E
                        Twicea Part #
                        903-488-XCZU9CG-2LFFVC900E                         		AMD Xilinx
                        Description: Microprocessor Circuit,
                        Datasheet Compare
                          Min.:1
                          Mult.:1
                          		 YES 900 2018-03-09 XILINX INC 4 110 °C - PLASTIC/EPOXY BGA - BGA900,30X30,40 SQUARE GRID ARRAY Transferred Yes 0.85 V e1 Tin/Silver/Copper (Sn/Ag/Cu) 8542.31.00.01 BOTTOM BALL 245 1 mm compliant 30 S-PBGA-B900 OTHER PROGRAMMABLE SoC 3.42 mm CAN, I2C, SPI, UART 31 mm 31 mm
                          XCZU9CG-2LFFVC900E
                          XCZU9CG-2LFFVC900E

                          903-488-XCZU9CG-2LFFVC900E AMD Xilinx
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                          AMD Xilinx XCZU17EG-1LFFVB1517I
                          Mfr. Part #
                          XCZU17EG-1LFFVB1517I
                          Twicea Part #
                          903-488-XCZU17EG-1LFFVB1517I                           		AMD Xilinx
                          Description: Microprocessor Circuit,
                          Datasheet Compare
                            Min.:1
                            Mult.:1
                            		 YES 1517 2018-03-09 XILINX INC 4 100 °C -40 °C PLASTIC/EPOXY BGA - BGA1517,39X39,40 SQUARE GRID ARRAY Transferred Yes 0.85 V e1 Tin/Silver/Copper (Sn/Ag/Cu) 8542.31.00.01 BOTTOM BALL 245 1 mm compliant 30 S-PBGA-B1517 INDUSTRIAL PROGRAMMABLE SoC 3.51 mm CAN, I2C, SPI, UART 40 mm 40 mm
                            XCZU17EG-1LFFVB1517I
                            XCZU17EG-1LFFVB1517I

                            903-488-XCZU17EG-1LFFVB1517I AMD Xilinx
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                            AMD Xilinx XCZU2CG-2LSFVA625I
                            Mfr. Part #
                            XCZU2CG-2LSFVA625I
                            Twicea Part #
                            903-488-XCZU2CG-2LSFVA625I                             		AMD Xilinx
                            Microcontroller,
                            Datasheet Compare
                              Min.:1
                              Mult.:1
                              		 YES 625 - XILINX INC - 100 °C -40 °C PLASTIC/EPOXY FBGA , BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH Transferred Yes 0.85 V - - 8542.31.00.01 BOTTOM BALL - 0.8 mm compliant - S-PBGA-B625 INDUSTRIAL PROGRAMMABLE SoC 3.43 mm CAN, I2C, SPI, UART 21 mm 21 mm
                              XCZU2CG-2LSFVA625I
                              XCZU2CG-2LSFVA625I

                              903-488-XCZU2CG-2LSFVA625I AMD Xilinx
                              RoHS :
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                              In Stock : -
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                              AMD Xilinx XCZU4EG-1LSFVC784I
                              Mfr. Part #
                              XCZU4EG-1LSFVC784I
                              Twicea Part #
                              903-488-XCZU4EG-1LSFVC784I                               		AMD Xilinx
                              Microprocessor Circuit,
                              Datasheet Compare
                                Min.:1
                                Mult.:1
                                		 YES 784 2018-03-09 XILINX INC 4 100 °C -40 °C PLASTIC/EPOXY FBGA - BGA784,28X28,32 SQUARE GRID ARRAY, FINE PITCH Transferred Yes 0.85 V e1 TIN SILVER COPPER 8542.31.00.01 BOTTOM BALL 250 0.8 mm compliant 30 S-PBGA-B784 INDUSTRIAL PROGRAMMABLE SoC 3.32 mm CAN, I2C, SPI, UART 23 mm 23 mm
                                XCZU4EG-1LSFVC784I
                                XCZU4EG-1LSFVC784I

                                903-488-XCZU4EG-1LSFVC784I AMD Xilinx
                                RoHS :
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                                In Stock : -
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                                Integrated Circuits (ICs)

                                Embedded - Microcontrollers definition: A microcontroller (MCU for microcontroller unit) is a small computer on a single metal-oxide-semiconductor (MOS) integrated circuit (IC) chi... Embedded - Microcontrollers Product Listing: XCZU11EG-2LFFVC1156E,XCZU3CG-2LSBVA484E,XCZU2EG-2LSFVC784I,XCZU19EG-1LFFVE1924I,XCZU4CG-2LFBVB900E.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134263),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Embedded - Microcontrollers has 95 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Twicea.