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XCZU9CG-2LFFVC900E Tech Specifications

Xilinx  XCZU9CG-2LFFVC900E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 900Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Date Of Intro 2018-03-09
Moisture Sensitivity Levels 4
Operating Temperature-Max 110 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Terminal Pitch 1 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.42 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 31 mm
Width 31 mm
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XCZU9CG-2LFFVC900E Documents

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