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| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Date Of Intro | For Use With | Ihs Manufacturer | Manufacturer | Mfr | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Rohs Code | Supply Voltage-Nom | Operating Temperature | Series | Size / Dimension | JESD-609 Code | Connector Type | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Temperature Grade | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Seated Height-Max | Core Architecture | Bus Compatibility | Module/Board Type | Flash Size | Kit Contents | Co-Processor | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. Part #SM-K26-XCL2GCTwicea Part #903-488-SM-K26-XCL2GC | Xilinx |
Plug-In Module,XCK26-SFVC784-2LV-C, Kria SOM Carrier Card
Datasheet
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| Min.:1 Mult.:1 | - | - | - | Kria SOM Carrier Card | - | Silicon Power Cube | AMD Xilinx | - | - | - | Box | - | - | - | - | - | - | - | Active | - | - | 0°C ~ 85°C (TJ) | Zynq® UltraScale+™ Kria™ | 3.030 L x 2.360 W (77.00mm x 60.00mm) | - | 2 x 240 Pin | - | - | - | - | - | - | - | - | - | - | 533MHz, 1.333GHz | 4GB | - | ARM® Cortex®-A53 | - | ARM | - | FPGA Core | 16GB eMMC, 64MB QSPI | Kria K26 System-on-Module XCK26-SFVC784-2LV-C | Arm® Cortex®-R5F | - | - | ||
| SM-K26-XCL2GC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU2CG-1LSFVA625ITwicea Part #903-488-XCZU2CG-1LSFVA625I | AMD Xilinx |
Description: Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 625 | 2018-03-09 | - | XILINX INC | - | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | - | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.43 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 21 mm | 21 mm | ||
| XCZU2CG-1LSFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-1LFFVC900ITwicea Part #903-488-XCZU9CG-1LFFVC900I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | 2018-03-09 | - | XILINX INC | - | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.42 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 31 mm | 31 mm | ||
| XCZU9CG-1LFFVC900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU7CG-1LFBVB900ITwicea Part #903-488-XCZU7CG-1LFBVB900I | AMD Xilinx |
Description: Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | 2018-03-09 | - | XILINX INC | - | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 2.88 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 31 mm | 31 mm | ||
| XCZU7CG-1LFBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU2EG-2LSBVA484ETwicea Part #903-488-XCZU2EG-2LSBVA484E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 484 | 2018-03-09 | - | XILINX INC | - | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | FBGA | - | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | OTHER | - | - | PROGRAMMABLE SoC | - | 2.61 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 19 mm | 19 mm | ||
| XCZU2EG-2LSBVA484E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6EG-1LFFVC900ITwicea Part #903-488-XCZU6EG-1LFFVC900I | AMD Xilinx |
Description: Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | 2018-03-09 | - | XILINX INC | - | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.42 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 31 mm | 31 mm | ||
| XCZU6EG-1LFFVC900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU7EG-1LFFVC1156ITwicea Part #903-488-XCZU7EG-1LFFVC1156I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1156 | 2018-03-09 | - | XILINX INC | - | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.51 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 35 mm | 35 mm | ||
| XCZU7EG-1LFFVC1156I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6EG-2LFFVC900ETwicea Part #903-488-XCZU6EG-2LFFVC900E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | 2018-03-09 | - | XILINX INC | - | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.42 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 31 mm | 31 mm | ||
| XCZU6EG-2LFFVC900E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU3CG-2LSFVC784ITwicea Part #903-488-XCZU3CG-2LSFVC784I | AMD Xilinx |
Microcontroller,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | - | - | XILINX INC | - | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | , | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.32 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 23 mm | 23 mm | ||
| XCZU3CG-2LSFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU4EV-2LFBVB900ETwicea Part #903-488-XCZU4EV-2LFBVB900E | AMD Xilinx |
Description: Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | 2018-03-09 | - | XILINX INC | - | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | OTHER | - | - | PROGRAMMABLE SoC | - | 2.88 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 31 mm | 31 mm | ||
| XCZU4EV-2LFBVB900E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU7EV-1LFBVB900ITwicea Part #903-488-XCZU7EV-1LFBVB900I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | 2018-03-09 | - | XILINX INC | - | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 2.88 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 31 mm | 31 mm | ||
| XCZU7EV-1LFBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU4EG-2LSFVC784ETwicea Part #903-488-XCZU4EG-2LSFVC784E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | 2018-03-09 | - | XILINX INC | - | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | FBGA | - | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.32 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 23 mm | 23 mm | ||
| XCZU4EG-2LSFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU19EG-2LFFVE1924ETwicea Part #903-488-XCZU19EG-2LFFVE1924E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1924 | 2018-03-09 | - | XILINX INC | - | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | - | BGA1924,44X44,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1924 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.71 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 45 mm | 45 mm | ||
| XCZU19EG-2LFFVE1924E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU4CG-2LFBVB900ITwicea Part #903-488-XCZU4CG-2LFBVB900I | AMD Xilinx |
Microcontroller,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | - | - | XILINX INC | - | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | , | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 2.88 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 31 mm | 31 mm | ||
| XCZU4CG-2LFBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU17EG-1LFFVE1924ITwicea Part #903-488-XCZU17EG-1LFFVE1924I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1924 | 2018-03-09 | - | XILINX INC | - | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | - | BGA1924,44X44,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1924 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.71 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 45 mm | 45 mm | ||
| XCZU17EG-1LFFVE1924I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU2EG-2LSFVA625ETwicea Part #903-488-XCZU2EG-2LSFVA625E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 625 | 2018-03-09 | - | XILINX INC | - | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | FBGA | - | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.43 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 21 mm | 21 mm | ||
| XCZU2EG-2LSFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU9CG-2LFFVC900ITwicea Part #903-488-XCZU9CG-2LFFVC900I | AMD Xilinx |
Microcontroller,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | - | - | XILINX INC | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | , | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.42 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 31 mm | 31 mm | ||
| XCZU9CG-2LFFVC900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU5EV-2LSFVC784ETwicea Part #903-488-XCZU5EV-2LSFVC784E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | 2018-03-09 | - | XILINX INC | - | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | FBGA | - | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.32 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 23 mm | 23 mm | ||
| XCZU5EV-2LSFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU3EG-2LSFVA625ETwicea Part #903-488-XCZU3EG-2LSFVA625E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 625 | 2018-03-09 | - | XILINX INC | - | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | FBGA | - | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.43 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 21 mm | 21 mm | ||
| XCZU3EG-2LSFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCZU6CG-2LFFVC900ITwicea Part #903-488-XCZU6CG-2LFFVC900I | AMD Xilinx |
Description: Microcontroller,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 900 | - | - | XILINX INC | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | , | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | Yes | 0.85 V | - | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.42 mm | - | CAN, I2C, SPI, UART | - | - | - | - | 31 mm | 31 mm | ||
| XCZU6CG-2LFFVC900I |
Index :
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