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- Embedded - Microcontrollers
Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Temperature Grade | uPs/uCs/Peripheral ICs Type | Seated Height-Max | Bus Compatibility | Length | Width |
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Mfr. Part #XCZU3EG-2LSFVA625ITwicea Part #903-488-XCZU3EG-2LSFVA625I | AMD Xilinx |
Description: Microcontroller,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 625 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | , | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | compliant | - | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | |||
XCZU3EG-2LSFVA625I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU17EG-1LFFVC1760ITwicea Part #903-488-XCZU17EG-1LFFVC1760I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1760 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | - | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1760 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | CAN, I2C, SPI, UART | 42.5 mm | 42.5 mm | |||
XCZU17EG-1LFFVC1760I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU3CG-1LSFVC784ITwicea Part #903-488-XCZU3CG-1LSFVC784I | AMD Xilinx |
Description: Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | - | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||
XCZU3CG-1LSFVC784I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU7CG-1LFFVF1517ITwicea Part #903-488-XCZU7CG-1LFFVF1517I | AMD Xilinx |
Description: Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1517 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | - | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 40 mm | 40 mm | |||
XCZU7CG-1LFFVF1517I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU3EG-2LSBVA484ITwicea Part #903-488-XCZU3EG-2LSBVA484I | AMD Xilinx |
Microcontroller,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | , | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | compliant | - | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | |||
XCZU3EG-2LSBVA484I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU5EG-2LSFVC784ETwicea Part #903-488-XCZU5EG-2LSFVC784E | AMD Xilinx |
Description: Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | FBGA | - | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||
XCZU5EG-2LSFVC784E | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU2CG-2LSFVC784ETwicea Part #903-488-XCZU2CG-2LSFVC784E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | FBGA | - | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||
XCZU2CG-2LSFVC784E | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU2EG-1LSFVA625ITwicea Part #903-488-XCZU2EG-1LSFVA625I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 625 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | - | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | |||
XCZU2EG-1LSFVA625I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU3CG-1LSFVA625ITwicea Part #903-488-XCZU3CG-1LSFVA625I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 625 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | - | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | |||
XCZU3CG-1LSFVA625I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU19EG-2LFFVC1760ETwicea Part #903-488-XCZU19EG-2LFFVC1760E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1760 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1760 | OTHER | PROGRAMMABLE SoC | 3.71 mm | CAN, I2C, SPI, UART | 42.5 mm | 42.5 mm | |||
XCZU19EG-2LFFVC1760E | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU5EG-1LSFVC784ITwicea Part #903-488-XCZU5EG-1LSFVC784I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 784 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | - | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||
XCZU5EG-1LSFVC784I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU6CG-1LFFVB1156ITwicea Part #903-488-XCZU6CG-1LFFVB1156I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1156 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||
XCZU6CG-1LFFVB1156I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU11EG-1LFFVC1760ITwicea Part #903-488-XCZU11EG-1LFFVC1760I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1760 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | - | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1760 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | CAN, I2C, SPI, UART | 42.5 mm | 42.5 mm | |||
XCZU11EG-1LFFVC1760I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU19EG-1LFFVB1517ITwicea Part #903-488-XCZU19EG-1LFFVB1517I | AMD Xilinx |
Description: Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1517 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | - | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 40 mm | 40 mm | |||
XCZU19EG-1LFFVB1517I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU9CG-2LFFVB1156ETwicea Part #903-488-XCZU9CG-2LFFVB1156E | AMD Xilinx |
Description: Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1156 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||
XCZU9CG-2LFFVB1156E | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU7EV-2LFFVF1517ETwicea Part #903-488-XCZU7EV-2LFFVF1517E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1517 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1517 | OTHER | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 40 mm | 40 mm | |||
XCZU7EV-2LFFVF1517E | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU19EG-2LFFVB1517ETwicea Part #903-488-XCZU19EG-2LFFVB1517E | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1517 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1517 | OTHER | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 40 mm | 40 mm | |||
XCZU19EG-2LFFVB1517E | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU6EG-1LFFVB1156ITwicea Part #903-488-XCZU6EG-1LFFVB1156I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1156 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||
XCZU6EG-1LFFVB1156I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU7CG-2LFFVF1517ITwicea Part #903-488-XCZU7CG-2LFFVF1517I | AMD Xilinx |
Microcontroller,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1517 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | , | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 40 mm | 40 mm | |||
XCZU7CG-2LFFVF1517I | ||||||||||||||||||||||||||||||||||||||
Mfr. Part #XCZU9CG-1LFFVB1156ITwicea Part #903-488-XCZU9CG-1LFFVB1156I | AMD Xilinx |
Microprocessor Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 1156 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||
XCZU9CG-1LFFVB1156I |
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