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XCZU5CG-2LSFVC784I Tech Specifications

Xilinx  XCZU5CG-2LSFVC784I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 784Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description ,
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA784,28X28,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom 0.85 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B784
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.32 mm
Bus Compatibility CAN, I2C, SPI, UART
Length 23 mm
Width 23 mm
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XCZU5CG-2LSFVC784I Documents

Download datasheets and manufacturer documentation for   XCZU5CG-2LSFVC784I

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