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| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Access Time-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | I/O Type | Memory IC Type | Mixed Memory Type | Length | Width |
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  | Mfr. Part #XC17S50XLSOG20CTwicea Part #903-633-XC17S50XLSOG20C | AMD Xilinx |
Description: Memory Circuit, 559232X1, CMOS, PDSO20, PLASTIC, SOP-20
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 20 | - | - | XILINX INC | 3 | 559232 words | 559232 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.71 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | - | 559232X1 | - | 2.65 mm | 1 | - | 559232 bit | - | - | MEMORY CIRCUIT | - | 12.8 mm | 7.5 mm | ||
| XC17S50XLSOG20C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M4-4101S-Z3Twicea Part #787-633-M4-4101S-Z3 | Moujen Switch |
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Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| M4-4101S-Z3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #SSDSC2KB240G701Twicea Part #386-633-SSDSC2KB240G701 | Intel Corporation |
Computers/Accessories,
Datasheet
Compare
| Min.:1 Mult.:1 | - | - | - | 2018-07-23 | INTEL CORP | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | - | - | EAR99 | - | - | 8542.32.00.71 | - | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MEMORY CIRCUIT | - | - | - | ||
| SSDSC2KB240G701 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #S82S141F883CTwicea Part #16059-633-S82S141F883C | Philips Semiconductors |
Description: SPECIALTY MEMORY CIRCUIT, CDIP24, CERAMIC, DIP-24
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 24 | 90 ns | - | SIGNETICS CORP | - | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.71 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | - | R-CDIP-T24 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.185 mA | 512X8 | - | - | 8 | - | 4096 bit | MIL-STD-883 | - | MEMORY CIRCUIT | - | - | - | ||
| S82S141F883C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #S82S141F883CTwicea Part #637-633-S82S141F883C | NXP Semiconductors |
IC SPECIALTY MEMORY CIRCUIT, CDIP24, CERAMIC, DIP-24, Memory IC:Other
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 24 | 90 ns | - | SIGNETICS CORP | - | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.71 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | 24 | R-CDIP-T24 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.185 mA | 512X8 | - | - | 8 | - | 4096 bit | MIL-STD-883 | - | MEMORY CIRCUIT | - | - | - | ||
| S82S141F883C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #HY64UD16322A-DF70ETwicea Part #16700-633-HY64UD16322A-DF70E | SK Hynix Inc |
Description: Memory IC, 2MX16, CMOS, PBGA48
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 48 | 70 ns | - | SK HYNIX INC | - | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA48,6X8,30 | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | - | 3 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.75 mm | unknown | - | - | R-PBGA-B48 | Not Qualified | - | OTHER | - | - | 0.025 mA | 2MX16 | 3-STATE | - | 16 | 0.000002 A | 33554432 bit | - | COMMON | - | - | - | - | ||
| HY64UD16322A-DF70E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #S72NS256PD0AJBLG3Twicea Part #18525-633-S72NS256PD0AJBLG3 | Spansion |
Memory Circuit, 16MX16, CMOS, PBGA133, 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 133 | - | - | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e2 | - | EAR99 | TIN SILVER COPPER NICKEL | DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 133 | S-PBGA-B133 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | - | 16MX16 | - | 1.1 mm | 16 | - | 268435456 bit | - | - | MEMORY CIRCUIT | - | 8 mm | 8 mm | ||
| S72NS256PD0AJBLG3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #PF38F5060M0Y0B0Twicea Part #386-633-PF38F5060M0Y0B0 | Intel Corporation |
Description: Memory Circuit, Flash PSRAM, 32MX16, CMOS, PBGA105, 9 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, SCSP-105
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 105 | - | - | INTEL CORP | 3 | 33554432 words | 32000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA105,9X12,32 | BGA105,9X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 1.8 V | e1 | - | EAR99 | TIN SILVER COPPER | PSEUDO SRAM IS ORGANIZED AS 8M X 16 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 105 | R-PBGA-B105 | Not Qualified | 2 V | OTHER | 1.7 V | SYNCHRONOUS | - | 32MX16 | - | 1.2 mm | 16 | 0.00012 A | 536870912 bit | - | - | MEMORY CIRCUIT | FLASH+PSRAM | 11 mm | 9 mm | ||
| PF38F5060M0Y0B0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #TH50VSF2580AASBTwicea Part #4669-633-TH50VSF2580AASB | Toshiba America Electronic Components |
IC SPECIALTY MEMORY CIRCUIT, PBGA69, 12 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-69, Memory IC:Other
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 69 | 90 ns | - | TOSHIBA CORP | - | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | LFBGA, BGA69,10X12,32 | BGA69,10X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Transferred | BGA | No | 3 V | e0 | No | EAR99 | TIN LEAD | USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | unknown | - | 69 | R-PBGA-B69 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.05 mA | 2MX16 | - | 1.4 mm | 16 | - | 33554432 bit | - | - | MEMORY CIRCUIT | FLASH+SRAM | 12 mm | 9 mm | ||
| TH50VSF2580AASB 4669-633-TH50VSF2580AASB Toshiba America Electronic Components
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| | Mfr. Part #RD28F3208C3T70Twicea Part #386-633-RD28F3208C3T70 | Intel Corporation |
Memory Circuit, Flash SRAM, 2MX16, CMOS, PBGA66, 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 66 | 70 ns | - | INTEL CORP | - | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | LFBGA, BGA68,8X12,32 | BGA68,8X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | - | - | EAR99 | - | SRAM IS ORGANIZED AS 512K X 16 | 8542.32.00.71 | BOTTOM | BALL | 240 | 1 | 0.8 mm | compliant | 30 | 66 | R-PBGA-B66 | Not Qualified | 3.3 V | COMMERCIAL EXTENDED | 2.7 V | ASYNCHRONOUS | 0.055 mA | 2MX16 | - | 1.4 mm | 16 | 0.000006 A | 33554432 bit | - | - | MEMORY CIRCUIT | FLASH+SRAM | 10 mm | 8 mm | ||
| RD28F3208C3T70 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #S71GL128NB0BFW9Z0Twicea Part #18525-633-S71GL128NB0BFW9Z0 | Spansion |
Memory Circuit, 8MX16, CMOS, PBGA64, 8 X 11.60 MM, 1.20 MM HIEGHT, LEAD FREE, FBGA-64
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 64 | - | - | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 11.60 MM, 1.20 MM HIEGHT, LEAD FREE, FBGA-64 | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | - | 3A991.B.1.A | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 64 | R-PBGA-B64 | Not Qualified | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | - | 8MX16 | - | 1.2 mm | 16 | - | 134217728 bit | - | - | MEMORY CIRCUIT | - | 11.6 mm | 8 mm | ||
| S71GL128NB0BFW9Z0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #LRS1806KTwicea Part #733-633-LRS1806K | Sharp Microelectronics of the Americas |
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Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| LRS1806K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #R8A66120FFATwicea Part #668-633-R8A66120FFA | Renesas Electronics Corporation |
SPECIALTY MEMORY CIRCUIT, PQFP48, 7 X 7 MM, 0.50 MM PITCH, PLASTIC, LQFP-48
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 48 | 6 ns | - | RENESAS ELECTRONICS CORP | - | 2097152 words | 2000000 | 70 °C | - | PLASTIC/EPOXY | LFQFP | LFQFP, QFP48,.35SQ,20 | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | - | 3.3 V | - | - | EAR99 | - | - | 8542.32.00.71 | QUAD | GULL WING | - | 1 | 0.5 mm | unknown | - | 48 | S-PQFP-G48 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.15 mA | 2MX4 | - | 1.7 mm | 4 | - | 8388608 bit | - | - | MEMORY CIRCUIT | - | 7 mm | 7 mm | ||
| R8A66120FFA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #SSDSCKJR150G7XATwicea Part #386-633-SSDSCKJR150G7XA | Intel Corporation |
Memory Circuit,
Datasheet
Compare
| Min.:1 Mult.:1 | - | - | - | 2018-07-27 | INTEL CORP | - | 161061273600 words | 150000000000 | 70 °C | - | UNSPECIFIED | - | PACKAGE | - | RECTANGULAR | - | Active | - | - | - | - | - | EAR99 | - | - | 8542.32.00.71 | - | - | - | 1 | - | compliant | - | - | - | - | - | COMMERCIAL | - | ASYNCHRONOUS | - | 150GX8 | - | - | 8 | - | 1288490188800 bit | - | - | MEMORY CIRCUIT | - | - | - | ||
| SSDSCKJR150G7XA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M4-4112-Z3Twicea Part #787-633-M4-4112-Z3 | Moujen Switch |
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Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| M4-4112-Z3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M4-4112RS-Z2Twicea Part #787-633-M4-4112RS-Z2 | Moujen Switch |
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Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| M4-4112RS-Z2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #S71VS256RD0AHKBL0Twicea Part #217-633-S71VS256RD0AHKBL0 | Cypress Semiconductor |
Memory Circuit, Flash PSRAM, CMOS, PBGA56,
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 56 | - | - | CYPRESS SEMICONDUCTOR CORP | - | - | - | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | - | BGA56,10X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | Transferred | - | Yes | 1.8 V | - | - | EAR99 | - | - | 8542.32.00.71 | BOTTOM | BALL | - | - | 0.5 mm | compliant | - | - | R-PBGA-B56 | Not Qualified | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | MEMORY CIRCUIT | FLASH+PSRAM | - | - | ||
| S71VS256RD0AHKBL0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #SST32HF3281-70-4E-LSETwicea Part #349-633-SST32HF3281-70-4E-LSE | Greenliant Systems Ltd |
Memory IC
Datasheet
Compare
| Min.:1 Mult.:1 | - | - | - | - | GREENLIANT SYSTEMS LTD | - | - | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | - | - | EAR99 | - | - | 8542.32.00.71 | - | - | - | - | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| SST32HF3281-70-4E-LSE | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #S71GL256NB0BAWAZ3Twicea Part #18525-633-S71GL256NB0BAWAZ3 | Spansion |
Description: Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HIEGHT, FBGA-84
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 84 | - | - | SPANSION INC | - | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | e0 | - | EAR99 | TIN LEAD | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 84 | R-PBGA-B84 | Not Qualified | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | - | 16MX16 | - | 1.2 mm | 16 | - | 268435456 bit | - | - | MEMORY CIRCUIT | - | 11.6 mm | 8 mm | ||
| S71GL256NB0BAWAZ3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M4-4112S-Z3Twicea Part #787-633-M4-4112S-Z3 | Moujen Switch |
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Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| M4-4112S-Z3 |
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