| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Organization | Output Characteristics | Seated Height-Max | Memory Width | Memory Density | Screening Level | Parallel/Serial | Memory IC Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. Part #XC1701-PD8MTwicea Part #903-535-XC1701-PD8M | AMD Xilinx |
Description: Configuration Memory, 1MX1, 45ns, Parallel, CMOS, PDIP8, PLASTIC, DIP-8
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 8 | 45 ns | XILINX INC | 1 | 1048576 words | 1000000 | 125 °C | -55 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Transferred | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | compliant | - | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | 1MX1 | - | 4.5974 mm | 1 | 1048576 bit | - | PARALLEL | CONFIGURATION MEMORY | 9.3599 mm | 7.62 mm | ||
| XC1701-PD8M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XQR1704LCC44MTwicea Part #903-535-XQR1704LCC44M | AMD Xilinx |
Description: Configuration Memory, 4MX1, Serial, CMOS, CQCC44, CC-44
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 44 | - | XILINX INC | - | 4194304 words | 4000000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCJ | CC-44 | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 3.3 V | e0 | No | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.51 | QUAD | J BEND | - | 1 | 1.27 mm | compliant | - | 44 | S-CQCC-J44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | 4MX1 | - | 4.826 mm | 1 | 4194304 bit | MIL-PRF-38535 | SERIAL | CONFIGURATION MEMORY | 16.51 mm | 16.51 mm | ||
| XQR1704LCC44M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17256D-DDG8MTwicea Part #903-535-XC17256D-DDG8M | AMD Xilinx |
Configuration Memory, 256KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8
Datasheet
Compare
| 930
In Stock
| Min.:1 Mult.:1 | NO | 8 | - | XILINX INC | - | 262144 words | 256000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 5 V | e3 | Yes | 3A001.A.2.C | MATTE TIN | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | compliant | - | 8 | R-GDIP-T8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | 256KX1 | 3-STATE | 4.318 mm | 1 | 262144 bit | - | SERIAL | CONFIGURATION MEMORY | 9.906 mm | 7.62 mm | |
| XC17256D-DDG8M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17S50ASOG20ITwicea Part #903-535-XC17S50ASOG20I | AMD Xilinx |
Configuration Memory, 559200X1, Serial, CMOS, PDSO20, PLASTIC, SOIC-20
Datasheet
Compare
| 980
In Stock
| Min.:1 Mult.:1 | YES | 20 | - | XILINX INC | 3 | 559200 words | 559200 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 559200X1 | - | 2.65 mm | 1 | 559200 bit | - | SERIAL | CONFIGURATION MEMORY | 12.8 mm | 7.5 mm | |
| XC17S50ASOG20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC1701-SOG20MTwicea Part #903-535-XC1701-SOG20M | AMD Xilinx |
Configuration Memory, 1MX1, 45ns, Parallel, CMOS, PDSO20, PLASTIC, SOIC-20
Datasheet
Compare
| 588
In Stock
| Min.:1 Mult.:1 | YES | 20 | 45 ns | XILINX INC | 3 | 1048576 words | 1000000 | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | PLASTIC, SOIC-20 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | Yes | 5 V | e3 | Yes | 3A001.A.2.C | MATTE TIN | - | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 1.27 mm | compliant | - | 20 | R-PDSO-G20 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | 1MX1 | - | 2.65 mm | 1 | 1048576 bit | - | PARALLEL | CONFIGURATION MEMORY | 12.8 mm | 7.5 mm | |
| XC1701-SOG20M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC1701LSOG20CTwicea Part #903-535-XC1701LSOG20C | AMD Xilinx |
Description: Configuration Memory, 1MX1, Serial, CMOS, PDSO20, PLASTIC, SOIC-20
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 20 | - | XILINX INC | 3 | 1048576 words | 1000000 | 70 °C | - | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e3 | - | EAR99 | Matte Tin (Sn) | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 1MX1 | - | 2.6416 mm | 1 | 1048576 bit | - | SERIAL | CONFIGURATION MEMORY | 12.827 mm | 7.5184 mm | ||
| XC1701LSOG20C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC18V04PCG44C0901Twicea Part #903-535-XC18V04PCG44C0901 | AMD Xilinx |
Description: Configuration Memory, 512KX8, 20ns, Parallel/serial, CMOS, PQCC44, PLASTIC, LCC-44
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 44 | 20 ns | XILINX INC | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-44 | SQUARE | CHIP CARRIER | Obsolete | LCC | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.1 | MATTE TIN | - | 8542.32.00.51 | QUAD | J BEND | - | 1 | 1.27 mm | compliant | - | 44 | S-PQCC-J44 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 512KX8 | - | 4.572 mm | 8 | 4194304 bit | - | PARALLEL/SERIAL | CONFIGURATION MEMORY | 16.5862 mm | 16.5862 mm | ||
| XC18V04PCG44C0901 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17S200XLSO20ITwicea Part #903-535-XC17S200XLSO20I | AMD Xilinx |
Configuration Memory, 1335872X1, Serial, CMOS, PDSO20, PLASTIC, SOIC-20
Datasheet
Compare
| 742
In Stock
| Min.:1 Mult.:1 | YES | 20 | - | XILINX INC | 3 | 1335872 words | 1335872 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | PLASTIC, SOIC-20 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e0 | No | 3A991.B.1.B.1 | Tin/Lead (Sn85Pb15) | - | 8542.32.00.51 | DUAL | GULL WING | 225 | 1 | 1.27 mm | not_compliant | 30 | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 1335872X1 | - | 2.65 mm | 1 | 1335872 bit | - | SERIAL | CONFIGURATION MEMORY | 12.8 mm | 7.5 mm | |
| XC17S200XLSO20I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17V04VQG44ITwicea Part #903-535-XC17V04VQG44I | AMD Xilinx |
Configuration Memory, 4MX1, Serial, CMOS, PQFP44, PLASTIC, QFP-44
Datasheet
Compare
| 24
In Stock
| Min.:1 Mult.:1 | YES | 44 | - | XILINX INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP, | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | Yes | 3.3 V | e3 | Yes | 3A991.B.1.B.1 | Matte Tin (Sn) | - | 8542.32.00.51 | QUAD | GULL WING | 260 | 1 | 0.8 mm | compliant | 30 | 44 | S-PQFP-G44 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 4MX1 | - | 1.2 mm | 1 | 4194304 bit | - | SERIAL | CONFIGURATION MEMORY | 10 mm | 10 mm | |
| XC17V04VQG44I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XCF01SVO20C0901Twicea Part #903-535-XCF01SVO20C0901 | AMD Xilinx |
Configuration Memory, 1MX1, Serial, CMOS, PDSO20, PLASTIC, TSSOP-20
Datasheet
Compare
| 771
In Stock
| Min.:1 Mult.:1 | YES | 20 | - | XILINX INC | - | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | - | 3.3 V | - | - | EAR99 | - | - | 8542.32.00.51 | DUAL | GULL WING | - | 1 | 0.65 mm | unknown | - | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 1MX1 | - | 1.19 mm | 1 | 1048576 bit | - | SERIAL | CONFIGURATION MEMORY | 6.5024 mm | 4.4 mm | |
| XCF01SVO20C0901 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #XC17S150AVOG8ITwicea Part #903-535-XC17S150AVOG8I | AMD Xilinx |
Configuration Memory, 1040096X1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8
Datasheet
Compare
| 894
In Stock
| Min.:1 Mult.:1 | YES | 8 | - | XILINX INC | 3 | 1040096 words | 1040096 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | - | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 1040096X1 | - | 1.2 mm | 1 | 1040096 bit | - | SERIAL | CONFIGURATION MEMORY | 4.9 mm | 3.9 mm | |
| XC17S150AVOG8I |
Index :
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