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| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Surface Mount | Number of Terminals | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. Part #RFFM6401Twicea Part #673-510-RFFM6401 | RF Micro Devices Inc |
Description: Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 28 | RF MICRO DEVICES INC | - | 3 | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, | - | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Transferred | - | Yes | 3.6 V | - | - | - | - | 8542.39.00.01 | BOTTOM | BUTT | - | 1 | - | unknown | - | - | R-XBGA-B28 | - | INDUSTRIAL | - | 1.25 mm | TELECOM CIRCUIT | 5.5 mm | 5 mm | ||
| RFFM6401 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF7173Twicea Part #673-510-RF7173 | RF Micro Devices Inc |
RF and Baseband Circuit
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| Min.:1 Mult.:1 | YES | 23 | RF MICRO DEVICES INC | - | 5A | 85 °C | -30 °C | UNSPECIFIED | QCCN | QCCN, LCC22(UNSPEC) | LCC22(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Transferred | MODULE | Yes | 3.6 V | - | Yes | 5A991.G | - | 8517.62.00.50 | UNSPECIFIED | NO LEAD | - | 1 | - | compliant | - | 23 | R-XXMA-N23 | Not Qualified | OTHER | 0.00008 mA | 1.015 mm | RF AND BASEBAND CIRCUIT | 6.63 mm | 5.24 mm | ||
| RF7173 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #SIW1711FIFTwicea Part #673-510-SIW1711FIF | RF Micro Devices Inc |
Description: Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 32 | RF MICRO DEVICES INC | MLF | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | DFN | No | 1.8 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | - | 0.9 mm | TELECOM CIRCUIT | 5 mm | 5 mm | ||
| SIW1711FIF | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFDA2125SQTwicea Part #673-510-RFDA2125SQ | RF Micro Devices Inc |
RF and Baseband Circuit
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| Min.:1 Mult.:1 | YES | 32 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HBCC | HBCC, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | - | - | 5 V | - | - | 5B991 | - | 9030.82.00.00 | BOTTOM | BUTT | - | 1 | 0.5 mm | unknown | - | - | S-XBCC-B32 | - | INDUSTRIAL | - | 1.25 mm | RF AND BASEBAND CIRCUIT | 5.2 mm | 5.2 mm | ||
| RFDA2125SQ | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFFM4501SBTwicea Part #673-510-RFFM4501SB | RF Micro Devices Inc |
Telecom Circuit
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| Min.:1 Mult.:1 | YES | 16 | RF MICRO DEVICES INC | - | - | 70 °C | -10 °C | UNSPECIFIED | - | , | - | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | - | - | 5 V | - | - | 5A991.G | - | 8517.62.00.50 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | - | S-XQMA-N16 | - | COMMERCIAL | - | 1.05 mm | TELECOM CIRCUIT | 3 mm | 3 mm | ||
| RFFM4501SB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF9904Twicea Part #673-510-RF9904 | RF Micro Devices Inc |
Telecom Circuit
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| Min.:1 Mult.:1 | YES | 16 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.25 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | - | - | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 1.27 mm | unknown | - | 16 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.035 mA | 1.905 mm | TELECOM CIRCUIT | 9.9 mm | 3.9 mm | ||
| RF9904 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF5722Twicea Part #673-510-RF5722 | RF Micro Devices Inc |
Telecom Circuit
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| Min.:1 Mult.:1 | YES | 8 | RF MICRO DEVICES INC | - | 2 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | 2.2 X 2.2 MM, 0.45 PITCH, GREEN, QFN-8 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | e3 | - | 5A991.G | MATTE TIN | 8517.70.00.00 | QUAD | NO LEAD | 260 | 1 | 0.65 mm | unknown | 30 | 8 | S-XQCC-N8 | Not Qualified | OTHER | - | 0.5 mm | TELECOM CIRCUIT | 2.2 mm | 2.2 mm | ||
| RF5722 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFFM8209SRTwicea Part #673-510-RFFM8209SR | RF Micro Devices Inc |
Telecom Circuit
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| Min.:1 Mult.:1 | YES | 16 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | - | - | 3.6 V | - | - | 5A991.G | - | 8517.62.00.50 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | - | S-XQCC-N16 | - | INDUSTRIAL | - | 0.4 mm | TELECOM CIRCUIT | 2.5 mm | 2.5 mm | ||
| RFFM8209SR | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF6505SRTwicea Part #673-510-RF6505SR | RF Micro Devices Inc |
Telecom Circuit
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| Min.:1 Mult.:1 | YES | 20 | RF MICRO DEVICES INC | - | 2 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.6 V | - | Yes | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | - | 1 | 0.5 mm | compliant | - | 20 | S-XQCC-N20 | Not Qualified | INDUSTRIAL | - | 0.6 mm | TELECOM CIRCUIT | 3.5 mm | 3.5 mm | ||
| RF6505SR | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF7308SRTwicea Part #673-510-RF7308SR | RF Micro Devices Inc |
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| 81
In Stock
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
| RF7308SR | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFDA3016SRTwicea Part #673-510-RFDA3016SR | RF Micro Devices Inc |
Description: Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 28 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | - | , | - | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | - | - | 5 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.7 mm | unknown | - | - | S-XQMA-N28 | - | INDUSTRIAL | - | 1.25 mm | TELECOM CIRCUIT | 6 mm | 6 mm | ||
| RFDA3016SR | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF6535Twicea Part #673-510-RF6535 | RF Micro Devices Inc |
Telecom Circuit
Datasheet
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| 1033
In Stock
| Min.:1 Mult.:1 | YES | 20 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC20,.14SQ,20 | LCC20,.14SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 20 | S-XQCC-N20 | Not Qualified | INDUSTRIAL | 0.26 mA | 0.5 mm | TELECOM CIRCUIT | 3.5 mm | 3.5 mm | |
| RF6535 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF5755Twicea Part #673-510-RF5755 | RF Micro Devices Inc |
Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 16 | RF MICRO DEVICES INC | - | 2 | 70 °C | -10 °C | UNSPECIFIED | HVQCCN | 3 X 3 MM, 0.50 MM HEIGHT, GREEN, QFN-16 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | e3 | - | - | MATTE TIN | 8542.39.00.01 | QUAD | NO LEAD | 260 | 1 | 0.5 mm | unknown | 30 | 16 | S-XQCC-N16 | Not Qualified | COMMERCIAL | 0.25 mA | 0.535 mm | TELECOM CIRCUIT | 3 mm | 3 mm | ||
| RF5755 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF6514SRTwicea Part #673-510-RF6514SR | RF Micro Devices Inc |
Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 28 | RF MICRO DEVICES INC | - | - | 70 °C | -30 °C | UNSPECIFIED | HBCC | HBCC, | - | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | Transferred | LGA | - | 3.6 V | - | - | EAR99 | - | 8517.62.00.50 | BOTTOM | BUTT | - | 1 | - | unknown | - | 28 | R-XBCC-B28 | - | OTHER | - | 1.25 mm | TELECOM CIRCUIT | 5.5 mm | 5 mm | ||
| RF6514SR | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF5603Twicea Part #673-510-RF5603 | RF Micro Devices Inc |
Telecom Circuit
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| 19080
In Stock
| Min.:1 Mult.:1 | YES | 16 | RF MICRO DEVICES INC | - | 2 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | 3 X 3 MM, 0.45 MM HEIGHT, GREEN, QFN-16 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | e3 | - | - | MATTE TIN | 8542.39.00.01 | QUAD | NO LEAD | 260 | 1 | 0.5 mm | unknown | 30 | 16 | S-XQCC-N16 | Not Qualified | INDUSTRIAL | - | 0.58 mm | TELECOM CIRCUIT | 3 mm | 3 mm | |
| RF5603 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFDA2046TR7Twicea Part #673-510-RFDA2046TR7 | RF Micro Devices Inc |
Baseband Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 28 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HQCCN | HQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | MCM | - | 5 V | - | - | 5A991.G | - | 8542.33.00.01 | QUAD | NO LEAD | - | 1 | 0.7 mm | unknown | - | 28 | S-XQCC-N28 | Not Qualified | INDUSTRIAL | - | 1.215 mm | BASEBAND CIRCUIT | 6 mm | 6 mm | ||
| RFDA2046TR7 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFPA5201ESBTwicea Part #673-510-RFPA5201ESB | RF Micro Devices Inc |
Telecom Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 14 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HTSON | HTSON, | - | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Transferred | - | - | 5 V | - | - | 5A991.G | - | 8542.33.00.01 | DUAL | NO LEAD | - | 1 | - | unknown | - | - | S-XDSO-N14 | - | INDUSTRIAL | - | 1.05 mm | TELECOM CIRCUIT | 7 mm | 7 mm | ||
| RFPA5201ESB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF6549Twicea Part #673-510-RF6549 | RF Micro Devices Inc |
Telecom Circuit
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| Min.:1 Mult.:1 | YES | 20 | RF MICRO DEVICES INC | - | - | - | - | UNSPECIFIED | QCCN | QCCN, | - | SQUARE | CHIP CARRIER | Transferred | - | - | 4.2 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | - | unknown | - | - | S-XQCC-N20 | - | - | - | - | TELECOM CIRCUIT | - | - | ||
| RF6549 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RF8889ATwicea Part #673-510-RF8889A | RF Micro Devices Inc |
RF and Baseband Circuit
Datasheet
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| Min.:1 Mult.:1 | YES | 26 | RF MICRO DEVICES INC | - | - | 90 °C | -30 °C | UNSPECIFIED | HQCCN | HQCCN, | - | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | Transferred | - | - | 2.75 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | - | unknown | - | - | R-XQCC-N26 | - | OTHER | - | 0.9 mm | RF AND BASEBAND CIRCUIT | 3.8 mm | 3 mm | ||
| RF8889A | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Part #RFFM8200SQTwicea Part #673-510-RFFM8200SQ | RF Micro Devices Inc |
Telecom IC
Datasheet
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| Min.:1 Mult.:1 | YES | 16 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QCCN | QCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | Transferred | - | Yes | 3.3 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | - | 0.5 mm | unknown | - | - | S-PQCC-N16 | Not Qualified | INDUSTRIAL | 230 mA | - | - | - | - | ||
| RFFM8200SQ |
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