RF5603 Tech Specifications

RFMD  RF5603 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 16Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer RF MICRO DEVICES INC
Part Package Code QFN
Package Description 3 X 3 MM, 0.45 MM HEIGHT, GREEN, QFN-16
Moisture Sensitivity Levels 2
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Nom 3.3 V
JESD-609 Code e3
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 16
JESD-30 Code S-XQCC-N16
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Seated Height-Max 0.58 mm
Telecom IC Type TELECOM CIRCUIT
Length 3 mm
Width 3 mm
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