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QSB20048S3V3 Tech Specifications

XP Power  QSB20048S3V3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mount PCB, Through Hole
Mounting Type Through Hole
Package / Case 9-DIP Module
Operating Temperature -40°C~100°C
Packaging Box
Series QSB (200W)
Published 2014
Size / Dimension 2.40Lx2.28W x 0.52 H 61.0mmx57.9mmx13.2mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 9Terminations
ECCN Code EAR99
Type Isolated Module
Applications ITE (Commercial)
Max Power Dissipation 132W
Terminal Position DUAL
Terminal Form PIN/PEG
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Depth 61mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XDMA-P9
Number of Outputs 1Output
Efficiency 88%
Voltage - Isolation 1.5kV
Voltage - Input (Max) 75V
Output Voltage 3.3V
Max Output Current 40A
Input Voltage-Nom 48V
Trim/Adjustable Output YES
Output Power 200W
Control Features Enable, Active High
Current - Output 1 40A
Max Output Power 200W
Max Input Voltage (DC) 75V
Min Input Voltage (DC) 18V
Features Remote On/Off, OCP, OTP, OVP, SCP
Height 13.208mm
Width 57.9mm
REACH SVHC Unknown
RoHS Status ROHS3 Compliant
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QSB20048S3V3 Documents

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