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XEF216-256-FB236-C20 Tech Specifications

XMOS  XEF216-256-FB236-C20 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 236-LFBGA
Number of Pins 236Pins
Supplier Device Package 236-FBGA (10x10)
Memory Types FLASH
Number of I/Os 73I/Os
Operating Temperature 0°C~70°C TA
Packaging Tray
Series XEF
Published 2015
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 500MHz
Interface USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Memory Size 2MB
Oscillator Type External
Speed 2000MIPS
RAM Size 256K x 8
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Core Processor XCore
Program Memory Type FLASH
Core Size 32-Bit 16-Core
Program Memory Size 2MB 2M x 8
Connectivity RGMII, USB
Core Architecture XCore
REACH SVHC Unknown
RoHS Status ROHS3 Compliant
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XEF216-256-FB236-C20 Documents

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