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- SS25D01L9
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SS25D01L9 Tech Specifications
XKB Connectivity SS25D01L9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Service Thermal Range | -40°C to +85°C | |
| Maximum Ratings | 0.3A 4V DC Resistive load | |
| Minimum Ratings | 50A 3V DCResistive load | |
| Low Temperature Resistance | -20°C 500h | |
| Heat Resisting Property | 85°C 500h | |
| Moisture Resistance | 60°C, 90 to 95%RH 500h | |
| Preheat Temp | 100°C | |
| Preheat Time | 60s max. | |
| Soldering Time | 350±10°C | |
| Solder Dipping Time | 3±1s | |
| Welding Times | 4s max. | |
| Contact Spring | Beryllium copper | |
| Contact Resistance | 70mΩ max./130mΩ max.Initial/Post-life | |
| Insulation Resistance | 100MΩ min. 500V DC | |
| Withstanding Voltage | 500V AC for 1 minute |
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