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XCZU9CG-2FFVC900I Tech Specifications

Xilinx  XCZU9CG-2FFVC900I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Number of I/Os 204I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Speed 533MHz, 1.3GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
RoHS Status ROHS3 Compliant
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XCZU9CG-2FFVC900I Documents

Download datasheets and manufacturer documentation for   XCZU9CG-2FFVC900I

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