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XC7Z045-2FBG676E Tech Specifications

Xilinx  XC7Z045-2FBG676E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/Os 130I/Os
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2009
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature 0°C
Frequency 800MHz
Base Part Number XC7Z045
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Speed 800MHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Max Frequency 733MHz
Speed Grade -2
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Radiation Hardening No
RoHS Status ROHS3 Compliant
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