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XC7Z007S-1CLG225C Tech Specifications

Xilinx  XC7Z007S-1CLG225C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Package / Case 225-LFBGA, CSPBGA
Surface Mount YES
Number of I/Os 54I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Zynq®-7000
Published 2016
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 225Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B225
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Speed 667MHz
RAM Size 256KB
Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Clock Frequency 667MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Artix™-7 FPGA, 23K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; PCI; SPI; UART; USB
Length 13mm
Height Seated (Max) 1.5mm
Width 13mm
RoHS Status ROHS3 Compliant
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