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- XC7K410T-1FFG900C
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XC7K410T-1FFG900C Tech Specifications
Xilinx XC7K410T-1FFG900C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Surface Mount | YES | |
| Package / Case | 900-BBGA, FCBGA | |
| Mounting Type | Surface Mount | |
| Number of Pins | 900Pins | |
| Number of I/Os | 500I/Os | |
| Published | 2010 | |
| Series | Kintex®-7 | |
| Packaging | Tray | |
| Operating Temperature | 0°C~85°C TJ | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Number of Terminations | 900Terminations | |
| ECCN Code | 3A991.D | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 0.97V~1.03V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Supply Voltage | 1V | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Base Part Number | XC7K410T | |
| Pin Count | 900 | |
| Number of Outputs | 500Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 11.83.3V | |
| RAM Size | 3.5MB | |
| Clock Frequency | 1098MHz | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 406720Logic Elements/Cells | |
| Total RAM Bits | 29306880 | |
| Number of LABs/CLBs | 31775LABs/CLBs | |
| Speed Grade | -1 | |
| Number of Registers | 508400Registers | |
| Combinatorial Delay of a CLB-Max | 0.74 ns | |
| Width | 31mm | |
| Height Seated (Max) | 3.35mm | |
| Length | 31mm | |
| RoHS Status | ROHS3 Compliant |
XC7K410T-1FFG900C Documents
Download datasheets and manufacturer documentation for XC7K410T-1FFG900C
- DatasheetsKintex-7 FPGAs Datasheet 7 Series FPGA Overview
- PCN Design/SpecificationMult Dev Material Chg 16/Dec/2019 Cross-Ship Lead-Free Notice 31/Oct/2016 Product Marking Chg 31/Oct/2016
- PCN PackagingMult Devices 26/Jun/2017
- PCN Assembly/OriginAdditional Wafer Fabrication 16/Dec/2013
- Environmental InformationXilinx RoHS3
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