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XC7K325T-2FFG900I Tech Specifications

Xilinx  XC7K325T-2FFG900I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Memory Types DDR3
Number of I/Os 500I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Kintex®-7
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900Terminations
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Voltage - Supply 0.97V~1.03V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number XC7K325T
Pin Count 900
JESD-30 Code S-PBGA-B900
Number of Outputs 500Outputs
Qualification Status Not Qualified
Power Supplies 11.83.3V
Memory Size 1GB
RAM Size 2MB
Clock Frequency 1818MHz
Number of Inputs 500Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 326080Logic Elements/Cells
Total RAM Bits 16404480
Number of LABs/CLBs 25475LABs/CLBs
Speed Grade -2
Number of Registers 407600Registers
Combinatorial Delay of a CLB-Max 0.61 ns
Length 31mm
Height Seated (Max) 3.35mm
Width 31mm
RoHS Status ROHS3 Compliant
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XC7K325T-2FFG900I Documents

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