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- XC3SD3400A-4FGG676C
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XC3SD3400A-4FGG676C Tech Specifications
Xilinx XC3SD3400A-4FGG676C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 10 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 676-BGA | |
| Number of Pins | 676Pins | |
| Number of I/Os | 469I/Os | |
| Operating Temperature | 0°C~85°C TJ | |
| Packaging | Tray | |
| Series | Spartan®-3A DSP | |
| Published | 2008 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 676Terminations | |
| ECCN Code | 3A991.D | |
| Voltage - Supply | 1.14V~1.26V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Supply Voltage | 1.2V | |
| Terminal Pitch | 1mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XC3SD3400A | |
| Pin Count | 676 | |
| Number of Outputs | 409Outputs | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 1.2V | |
| Power Supplies | 1.22.5/3.3V | |
| RAM Size | 283.5kB | |
| Clock Frequency | 250MHz | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 53712Logic Elements/Cells | |
| Total RAM Bits | 2322432 | |
| Number of Gates | 3400000Gates | |
| Number of LABs/CLBs | 5968LABs/CLBs | |
| Speed Grade | 4 | |
| Length | 27mm | |
| Height Seated (Max) | 2.6mm | |
| Width | 27mm | |
| REACH SVHC | Unknown | |
| RoHS Status | ROHS3 Compliant |
XC3SD3400A-4FGG676C Documents
Download datasheets and manufacturer documentation for XC3SD3400A-4FGG676C
- DatasheetsXC3SD3400A-4FGG676C-Xilinx-datasheet-10026773.pdf XC3SD3400A-4FGG676C-Xilinx-datasheet-41196668.pdf XC3SD3400A-4FGG676C-Xilinx-datasheet-6399872.pdf Spartan-3A DSP FPGA Datasheet XC3SD3400A-4FGG676C-Xilinx-datasheet-14104778.pdf Extended Spartan-3A Family Overview
- PCN Design/SpecificationFG(G) and BG(G) Wire Bond 25/Jan/2013 Copper Wire Bond Material 09/Dec/2013
- Environmental InformationXilinx RoHS3
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