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XC3S50A-4FTG256C Tech Specifications

Xilinx  XC3S50A-4FTG256C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256Pins
Supplier Device Package 256-FTBGA (17x17)
Number of I/Os 144I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Spartan®-3A
Published 2007
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Termination SMD/SMT
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Voltage - Supply 1.14V~1.26V
Frequency 250MHz
Base Part Number XC3S50A
Operating Supply Voltage 1.2V
Max Supply Voltage 1.26V
Min Supply Voltage 1.14V
RAM Size 6.8kB
Number of Logic Elements/Cells 1584Logic Elements/Cells
Total RAM Bits 55296
Number of Gates 50000Gates
Number of LABs/CLBs 176LABs/CLBs
Number of Logic Blocks (LABs) 1584Logic Blocks (LABs)s
Speed Grade 4
Number of Macro Cells 1584Macro Cells
Height 1mm
Length 17mm
Width 17mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
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XC3S50A-4FTG256C Documents

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