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XC2C384-10FT256I Tech Specifications

Xilinx  XC2C384-10FT256I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256Pins
Memory Types ROMless
Number of I/Os 212I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series CoolRunner II
Published 2001
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Additional Feature YES
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC2C384
Pin Count 256
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.9V
Programmable Type In System Programmable
Propagation Delay 10 ns
Number of Logic Elements/Cells 24Logic Elements/Cells
Number of Gates 9000Gates
Max Frequency 125MHz
Speed Grade 10
Output Function MACROCELL
Number of Macro Cells 384Macro Cells
JTAG BST YES
Voltage Supply - Internal 1.7V~1.9V
Delay Time tpd(1) Max 9.2ns
Length 17mm
Height Seated (Max) 1.55mm
Width 17mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
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