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XCVM1802-2HSIVSVD1760 Tech Specifications

Xilinx  XCVM1802-2HSIVSVD1760 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)
Number of I/Os 500I/Os
Package Tray
Mfr AMD Xilinx
Product Status Active
Operating Temperature -40°C ~ 100°C (TJ)
Series Versal™ Prime
Speed 800MHz, 1.65GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes Versal™ Prime FPGA, 1.9M Logic Cells
Flash Size -
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