XCVE1752-2LSENSVG1369 Tech Specifications

Xilinx  XCVE1752-2LSENSVG1369 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 1369-BFBGA
Supplier Device Package 1369-BGA (35x35)
Number of I/Os 500I/Os
Package Tray
Mfr AMD Xilinx
Product Status Active
Operating Temperature 0°C ~ 100°C (TJ)
Series Versal™ AI Core
Speed 450MHz, 1.08GHz
RAM Size -
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Flash Size -
View Similar
XCVE1752-2LSENSVG1369 brand manufacturers: Xilinx, Twicea stock, XCVE1752-2LSENSVG1369 reference price.Xilinx. XCVE1752-2LSENSVG1369 parameters, XCVE1752-2LSENSVG1369 Datasheet PDF and pin diagram description download.You can use the XCVE1752-2LSENSVG1369 Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCVE1752-2LSENSVG1369 pin diagram and circuit diagram and usage method of function,XCVE1752-2LSENSVG1369 electronics tutorials.You can download from the Twicea.