XCV812E-7BG560I Tech Specifications

Xilinx  XCV812E-7BG560I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 560Terminals
Manufacturer Part Number XCV812E-7BG560I
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-560
Risk Rank 5.85
Clock Frequency-Max 400 MHz
Moisture Sensitivity Levels 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Supply Voltage-Max 1.89 V
Supply Voltage-Nom 1.8 V
Reflow Temperature-Max (s) 30
Supply Voltage-Min 1.71 V
JESD-609 Code e0
Pbfree Code No
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Terminal Pitch 1.27 mm
Reach Compliance Code not_compliant
Pin Count 560
JESD-30 Code S-PBGA-B560
Number of Outputs 404Outputs
Qualification Status Not Qualified
Power Supplies 1.2/3.6,1.8 V
Temperature Grade INDUSTRIAL
Number of Inputs 404Inputs
Organization 4704 CLBS, 254016 GATES
Seated Height-Max 1.7 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max 0.42 ns
Number of CLBs 4704CLBs
Number of Logic Cells 21168Logic Cells
Number of Equivalent Gates 254016Equivalent Gates
Length 42.5 mm
Width 42.5 mm
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