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XCV150-6FGG256C Tech Specifications

Xilinx  XCV150-6FGG256C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 256Terminals
Manufacturer Part Number XCV150-6FGG256C
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Risk Rank 5.79
Clock Frequency-Max 333 MHz
Moisture Sensitivity Levels 3
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 2.625 V
Supply Voltage-Nom 2.5 V
Reflow Temperature-Max (s) 30
Supply Voltage-Min 2.375 V
JESD-609 Code e1
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 1 mm
Reach Compliance Code compliant
Pin Count 256
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Temperature Grade OTHER
Organization 864 CLBS, 164674 GATES
Seated Height-Max 2 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max 0.6 ns
Number of CLBs 864CLBs
Number of Equivalent Gates 164674Equivalent Gates
Length 17 mm
Width 17 mm
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