XC2V6000-6BF957I Tech Specifications

Xilinx  XC2V6000-6BF957I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 957Terminals
Manufacturer Part Number XC2V6000-6BF957I
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
Risk Rank 5.81
Clock Frequency-Max 820 MHz
Moisture Sensitivity Levels 4
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA957,31X31,50
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 1.575 V
Supply Voltage-Nom 1.5 V
T 30
Supply Voltage-Min 1.425 V
JESD-609 Code e0
Pbfree Code No
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Terminal Pitch 1.27 mm
Reach Compliance Code not_compliant
Pin Count 957
JESD-30 Code S-PBGA-B957
Number of Outputs 684Outputs
Qualification Status Not Qualified
Power Supplies 1.5,1.5/3.3,3.3 V
Number of Inputs 684Inputs
Organization 8448 CLBS, 6000000 GATES
Seated Height-Max 3.5 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max 0.35 ns
Number of CLBs 8448CLBs
Number of Logic Cells 76032Logic Cells
Number of Equivalent Gates 6000000Equivalent Gates
Length 40 mm
Width 40 mm
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