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XC2S300E-7FTG256C Tech Specifications

Xilinx  XC2S300E-7FTG256C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Pins 256Pins
Number of Terminals 256Terminals
Manufacturer Part Number XC2S300E-7FTG256C
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-256
Risk Rank 5.79
Clock Frequency-Max 400 MHz
Moisture Sensitivity Levels 3
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 1.89 V
Supply Voltage-Nom 1.8 V
Reflow Temperature-Max (s) 30
RoHS Compliant
Supply Voltage-Min 1.71 V
JESD-609 Code e1
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Max Operating Temperature 85 °C
Min Operating Temperature 0 °C
Additional Feature MAXIMUM USABLE GATES = 300000
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 1 mm
Reach Compliance Code unknown
Pin Count 256
JESD-30 Code S-PBGA-B256
Number of Outputs 329Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.8 V
Power Supplies 1.2/3.6,1.8 V
Temperature Grade OTHER
RAM Size 8 kB
Number of Inputs 329Inputs
Organization 1536 CLBS, 93000 GATES
Seated Height-Max 2 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Speed Grade 7
Combinatorial Delay of a CLB-Max 0.42 ns
Number of CLBs 1536CLBs
Number of Logic Cells 6912Logic Cells
Number of Equivalent Gates 93000Equivalent Gates
Length 17 mm
Width 17 mm
Radiation Hardening No
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