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W29GL128CH9T/REEL Tech Specifications

Winbond  W29GL128CH9T/REEL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) 3A991.b.1.a
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 128M
Block Organization Symmetrical
Location of Boot Block Bottom|Top
Address Bus Width (bit) 23
Number of Bits/Word (bit) 1
Number of Words 128MWord
Programmability Yes
Timing Type Asynchronous
Max. Access Time (ns) 100
Maximum Erase Time (S) 256/Chip
Maximum Page Access Time (ns) 35
Maximum Programming Time (ms) 224000/Chip
OE Access Time (ns) 35
Interface Type Parallel
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 55
Page Read Current (mA) 25
Program Current (mA) 30
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode Yes
Mounting Surface Mount
Package Height 1
Package Width 18.4
Package Length 14
PCB changed 56
Standard Package Name SOP
Supplier Package TSOP
Lead Shape Gull-wing
Part Status Obsolete
Pin Count 56
Architecture Sectored
Sector Size 128Kbyte x 128
Page Size 256byte
Boot Block Yes
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