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W25X40CLSVIG/TRAY Tech Specifications

Winbond  W25X40CLSVIG/TRAY technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) EAR99
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 4M
Block Organization Symmetrical
Location of Boot Block Bottom|Top
Address Bus Width (bit) 24
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 512KWord
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 8
Maximum Erase Time (S) 4/Chip
Maximum Programming Time (ms) 0.8/Page
Interface Type Serial (SPI, Dual SPI)
Minimum Operating Supply Voltage (V) 2.3
Maximum Operating Frequency (MHz) 104
Typical Operating Supply Voltage (V) 2.5|3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.3 to 3.6
Operating Current (mA) 14
Program Current (mA) 15
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Mounting Surface Mount
Package Height 0.8
Package Width 3.9
Package Length 4.9
PCB changed 8
Standard Package Name SOP
Supplier Package SOIC
Lead Shape Gull-wing
Part Status Active
Pin Count 8
Architecture Sectored
Sector Size 4Kbyte x 128
Page Size 256byte
Boot Block Yes
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