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W25Q64JVZEAM Tech Specifications

Winbond  W25Q64JVZEAM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6)
EU RoHS Compliant
HTS 8542.32.00.71
Automotive Yes
PPAP Unknown
Package Tube
Base Product Number W25Q64
Mfr Winbond Electronics
Product Status Active
Memory Types Non-Volatile
Operating Temperature -40°C ~ 105°C (TA)
Series SpiFlash®
Part Status Unconfirmed
Technology FLASH - NOR
Voltage - Supply 2.7V ~ 3.6V
Memory Size 64Mbit
Clock Frequency 133 MHz
Access Time 6 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O
Write Cycle Time - Word, Page 3ms
Memory Organization 8M x 8
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