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W25Q32JWZPIM/REEL Tech Specifications

Winbond  W25Q32JWZPIM/REEL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) 3A991.b.1.a
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 32M
Block Organization Symmetrical
Address Bus Width (bit) 24
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 4MWord
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 6
Maximum Erase Time (S) 50/Chip
Maximum Programming Time (ms) 5/Page
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V) 1.7
Maximum Operating Frequency (MHz) 133
Supplier Package WSON EP
PCB changed 8
Package Length 5
Package Width 6
Package Height 0.73
Mounting Surface Mount
Minimum Endurance (Cycles) 100000
Support of Page Mode No
ECC Support No
Command Compatible Yes
Supplier Temperature Grade Industrial
Maximum Operating Temperature (°C) 85
Minimum Operating Temperature (°C) -40
Program Current (mA) 20
Operating Current (mA) 20
Programming Voltage (V) 1.7 to 1.95
Maximum Operating Supply Voltage (V) 1.95
Typical Operating Supply Voltage (V) 1.8
Packaging Tube
Part Status Active
Pin Count 8
Architecture Sectored
Sector Size 4Kbyte x 1024
Page Size 256byte
Boot Block No
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