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W25Q32FWSSIG TRAY Tech Specifications

Winbond  W25Q32FWSSIG TRAY technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) 3A991.b.1.a
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 32M
Block Organization Symmetrical
Address Bus Width (bit) 24
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 4MWord
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 6
Maximum Erase Time (S) 50/Chip
Maximum Programming Time (ms) 5/Page
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V) 1.65
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.95
Programming Voltage (V) 1.65 to 1.95
Operating Current (mA) 20
Program Current (mA) 25
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
Minimum Endurance (Cycles) 100000
Mounting Surface Mount
Package Height 1.8
Package Width 5.28
Package Length 5.28
PCB changed 8
Standard Package Name SOP
Supplier Package SOIC
Lead Shape Gull-wing
Part Status Obsolete
Pin Count 8
Architecture Sectored
Sector Size 4Kbyte x 1024
Page Size 256byte
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