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W25Q16DVSFIG/TRAY Tech Specifications

Winbond  W25Q16DVSFIG/TRAY technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

EU RoHS Compliant
ECCN (US) EAR99
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 16M
Block Organization Symmetrical
Address Bus Width (bit) 24
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 2MWord
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 7
Maximum Erase Time (S) 10/Chip
Maximum Programming Time (ms) 3/Page
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 25
Program Current (mA) 25
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Mounting Surface Mount
Package Height 2.31
Package Width 7.49
Package Length 10.31
PCB changed 16
Standard Package Name SOP
Supplier Package SOIC W
Lead Shape Gull-wing
Part Status Obsolete
Pin Count 16
Architecture Sectored
Sector Size 4Kbyte x 512
Page Size 256byte
Boot Block No
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