Winbond Electronics Corp W91465 Telecom Interface ICs DUAL
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W91465 Tech Specifications
Winbond W91465 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 18Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP18,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| JESD-609 Code | e0 | |
| Terminal Finish | TIN LEAD | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | not_compliant | |
| JESD-30 Code | R-PDIP-T18 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| Supply Current-Max | 0.001 mA | |
| Crystal Frequency | 3.58 MHz | |
| Repertory | REPERTORY |
W91465 Documents
Download datasheets and manufacturer documentation for W91465
- DatasheetsWBNDS02390-1.pdf
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