W25Q128BVBIP Tech Specifications

Winbond  W25Q128BVBIP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 24Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description 8 X 6 MM, GREEN TFBGA-24
Supply Voltage-Nom (Vsup) 3 V
Package Style GRID ARRAY, THIN PROFILE
Package Shape RECTANGULAR
Package Equivalence Code BGA24,5X5,40
Package Code TBGA
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Number of Words Code 16000000Words Codes
Number of Words 16777216 wordsWord
Clock Frequency-Max (fCLK) 104 MHz
ECCN Code EAR99
Type NOR TYPE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B24
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.025 mA
Organization 16MX8
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 8
Standby Current-Max 0.000015 A
Memory Density 134217728 bit
Parallel/Serial SERIAL
Memory IC Type FLASH
Programming Voltage 3 V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Width 6 mm
Length 8 mm
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W25Q128BVBIP Documents

Download datasheets and manufacturer documentation for   W25Q128BVBIP

  • Datasheets
W25Q128BVBIP brand manufacturers: Winbond Electronics Corp, Twicea stock, W25Q128BVBIP reference price.Winbond Electronics Corp. W25Q128BVBIP parameters, W25Q128BVBIP Datasheet PDF and pin diagram description download.You can use the W25Q128BVBIP Memory - Modules, DSP Datesheet PDF, find W25Q128BVBIP pin diagram and circuit diagram and usage method of function,W25Q128BVBIP electronics tutorials.You can download from the Twicea.