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W25Q128BVBIP Tech Specifications
Winbond W25Q128BVBIP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 24Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | 8 X 6 MM, GREEN TFBGA-24 | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Package Shape | RECTANGULAR | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Code | TBGA | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Operating Temperature-Max | 85 °C | |
| Number of Words Code | 16000000Words Codes | |
| Number of Words | 16777216 wordsWord | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| ECCN Code | EAR99 | |
| Type | NOR TYPE | |
| HTS Code | 8542.32.00.51 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | R-PBGA-B24 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 0.025 mA | |
| Organization | 16MX8 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 1.2 mm | |
| Memory Width | 8 | |
| Standby Current-Max | 0.000015 A | |
| Memory Density | 134217728 bit | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 3 V | |
| Serial Bus Type | SPI | |
| Endurance | 100000 Write/Erase Cycles | |
| Data Retention Time-Min | 20 | |
| Write Protection | HARDWARE/SOFTWARE | |
| Width | 6 mm | |
| Length | 8 mm |
Index :
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