Winbond Electronics Corp W25N01GWSFIG Memory Modules
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W25N01GWSFIG Tech Specifications
Winbond W25N01GWSFIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 16Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | SOP, | |
| Date Of Intro | 2017-11-27 | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| Number of Words | 128057344 wordsWord | |
| Number of Words Code | 128000000Words Codes | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| ECCN Code | EAR99 | |
| Type | SLC NAND TYPE | |
| HTS Code | 8542.32.00.51 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-PDSO-G16 | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 128MX8 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 2.64 mm | |
| Memory Width | 8 | |
| Memory Density | 1024458752 bit | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 1.8 V | |
| Serial Bus Type | QSPI | |
| Length | 10.31 mm | |
| Width | 7.49 mm |
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